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Laser punching device and method for improving hole taper and hole wall quality

A laser drilling and taper technology, used in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of complex operation of the device, high mirror surface requirements, low efficiency, etc., to improve processing efficiency, improve processing quality, reduce cost effect

Inactive Publication Date: 2019-01-08
JIANGSU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the drilling process, the reflective adjustment mechanism must be controlled very precisely, and the mirror surface of the reflective device is extremely demanding, and it needs to be uniformly covered with microstructures. The device is complex and difficult to operate, and only one small hole can be processed at a time. lower

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  • Laser punching device and method for improving hole taper and hole wall quality
  • Laser punching device and method for improving hole taper and hole wall quality
  • Laser punching device and method for improving hole taper and hole wall quality

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Embodiment Construction

[0038] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but the protection scope of the present invention is not limited thereto.

[0039] A laser drilling device for improving hole taper and hole wall quality, including a workpiece processing system and a control system: the workpiece processing system includes a laser 4, a water tank 10, a fixture 8 and a workpiece 7; the laser beam 6 emitted by the laser 4 After being focused by the focusing lens 5, it is irradiated on the workpiece 7; the workpiece 7 is placed horizontally and fixed on the fixture 8; the fixture 8 is arranged at the bottom of the water tank 10; the liquid 11 in the water tank 10 is immersed in the lower surface of the workpiece 7 The control system includes a computer 1 and a motion control card 13, the computer 1 controls the laser 4 and the motion control card 13, and the motion control card 13 controls the x-y-z coordinate table...

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Abstract

The invention relates to a laser punching device and method for improving the hole taper and the hole wall quality, relates to the field of laser processing in non-traditional machining, and belongs to the field of laser processing in non-traditional machining. A workpiece machining system and a control system are included. The workpiece machining system comprises a laser device, a water trough, aclamp and a workpiece. Laser beams emitted by the laser device irradiate the workpiece after being focused through a focus lens. The workpiece is horizontally placed and fixed to the clamp. The clampis arranged at the bottom of the water trough. The liquid level of the liquid in the water trough immerses the lower surface of the workpiece. The control system comprises a computer and a motion control card, the computer controls the laser device and the motion control card, and the motion control card controls an x-y-z three-coordinate workbench. Compared with machining in which only a laser device is adopted, the small hole taper can be obviously reduced, heat damage is reduced, the small hole machining quality is improved, and the laser energy utilization rate is increased. The device issimple, and operation is convenient.

Description

technical field [0001] The invention relates to the field of laser processing in special processing, in particular to a laser drilling device and method for improving hole taper and hole wall quality. Background technique [0002] Laser drilling technology is a technology that uses a laser beam as a heat source and uses a heat removal method to separate materials. Compared with other drilling technologies, it has many advantages, and is widely used in the fields of processing metal materials, ceramic materials and polymer materials, and satisfies the needs of industries such as the automobile industry, semiconductor industry, watchmaking industry, and medical device manufacturing industry. Requirements for precision machining of certain key components. [0003] When using laser drilling technology to process the through holes of the above key components, the taper is an important quality index to measure the hole. The larger the taper, the worse the quality of the processed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/70
CPCB23K26/382B23K26/702
Inventor 朱帅杰张朝阳朱浩戴学仁王安斌王虹
Owner JIANGSU UNIV
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