Method for preparing large-size CVD (Chemical Vapor Deposition) diamond crystal
A diamond single crystal and diamond technology, applied in the field of diamond wafer preparation, can solve problems such as polycrystalline and poor crystal quality, and achieve the effects of ensuring crystal quality, ensuring crystal growth orientation, and inhibiting growth defects
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[0033] The manufacture method of large-scale semiconductor diamond wafer in the present invention mainly comprises the following steps:
[0034] 1. Cut the diamond single crystal grown by the HPHT method into multiple slices along the same direction, and the cutting seam 1 is as figure 1 As shown, after the cutting is completed, the surface is polished and processed to form a rectangular or square HPHT diamond single crystal wafer, which is used as a seed crystal for MPCVD diamond growth;
[0035] 2. Clean the surface of the HPHT diamond single crystal wafer. Specifically, treat the sample with aqua regia (concentrated hydrochloric acid: nitric acid = 3:1) at 55°C-65°C for 10 minutes, and then sonicate with acetone at room temperature for 10-15 minutes;
[0036] 3. If figure 2 As shown, the photoresist 2 is cast on the HPHT diamond single crystal wafer, and the hard film is baked for 30-60 minutes; the design pattern is formed after exposure by a photolithography machine.
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