Measuring method for thermal contraction of electronic glass for high resolution display

Abstract

The invention provides a measuring method for thermal contraction of electronic glass for high resolution display. The measuring method comprises the following steps: 1) taking a to-be-measured glasssample, carving two shape marks on the to-be-measured glass sample along the length direction and respectively marking as A and B; 2) measuring a distance between the mark A and the mark B, thereby acquiring the distance L0 before heat treatment; 3) putting the to-be-measured glass sample with the marks acquired in the step 1) into a heating device for heating; 4) measuring the distance between the mark A and the mark B after heat treatment, thereby acquiring the distance L; 5) calculating a thermal contraction rate a of the to-be-measured glass sample according to the acquired distance L0 anddistance L. According to the measuring method provided by the invention, the problem of big measuring error caused by the marking depth difference introduced by the marking of abrasive paper or glasscutter or the influence of load on length in the measuring process with a dilatometer can be solved, the measurement accuracy is promoted, the repeatability is excellent and a data reference can be more effectively provided to the manufacturing technique of display devices.

Description

technical field [0001] The invention belongs to the technical field of glass measurement, and in particular relates to a method for measuring heat shrinkage of electronic glass for high-resolution display. Background technique [0002] With the continuous development of display technology, people are increasingly pursuing high-resolution and high-quality images, and have higher requirements for the size and response time of TFTs. Due to its high electron mobility (1,000 times higher than amorphous silicon technology), LTPS technology allows the manufacture of driver ICs and other electronic devices on glass substrates, reducing device costs, simplifying the later module process, and improving yield. rate, thus becoming the current mainstream TFT manufacturing technology. [0003] The LTPS process generally uses laser annealing technology to crystallize the amorphous silicon layer. The most efficient polysilicon (p-Si) processing method is operated at a temperature above 600...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a method for measuring heat shrinkage of electronic glass for high-resolution display, which solves the defects of large measurement error and low precision in the existing method for measuring heat shrinkage of electronic glass

Images