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A method for extracting parameters of a piezoelectric multi-wafer equivalent circuit model

A technology of equivalent circuit model and parameter extraction, which is applied in electrical digital data processing, CAD circuit design, special data processing applications, etc.

Inactive Publication Date: 2019-01-11
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Some existing circuit parameter extraction methods rely on measuring the vibration state of the piezoelectric multi-chip to calculate and determine the parameters, and the required measuring instruments such as Doppler laser vibrometers are expensive

Method used

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  • A method for extracting parameters of a piezoelectric multi-wafer equivalent circuit model
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  • A method for extracting parameters of a piezoelectric multi-wafer equivalent circuit model

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Embodiment

[0055] In order to make the purpose, technical solutions and advantages of the present invention more clear, the following will give a specific description of the implementation of the present invention in conjunction with examples. To test a piezoelectric multi-chip, the experimental determination method of 5 independent parameters is as follows: one end of the piezoelectric multi-chip is fixed on the vibration source, and the other end is free, and the amplitude of the sinusoidal vibration acceleration of 1g is kept constant, and different load resistances are obtained by scanning the vibration frequency R L The relationship curve between output voltage and vibration frequency of the piezoelectric multi-chip is shown below. Short circuit resonant frequency f sc =842Hz is the frequency value corresponding to the maximum output voltage when the load resistance is 50Ω (approximate short circuit); the open circuit resonant frequency f oc =870Hz is the frequency value correspon...

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Abstract

A method for extracting parameters of a piezoelectric multi-wafer equivalent circuit model includes such steps as fixing one end of a piezoelectric multi-wafer on a vibration source, making the otherend free, keeping constant sinusoidal vibration acceleration amplitude a, and obtaining the relation curve between output voltage and vibration frequency of the piezoelectric multi-wafer under different load resistances RL through frequency sweeping. The short-circuit resonance frequency fsc, open-circuit resonance frequency foc, static capacitance Cmc, mechanical quality factor Qoc, maximum powervalue Popt and short-circuit resonance voltage VML (omega sc) are determined. The equivalent inductance Lm, the equivalent capacitance Cm, the equivalent resistance Rm, the equivalent input stress VF, the piezoelectric coupling coefficient A and the static capacitance Cmc are obtained. The invention can accurately describe the relationship between the output voltage characteristic of the piezoelectric multi-wafer and the load, the ambient vibration frequency and the acceleration, and the electric measuring instrument required for the measurement is low in cost.

Description

technical field [0001] The invention relates to the field of vibration environment energy collection technology and circuit design, and more specifically relates to a method for extracting parameters of a piezoelectric multi-chip equivalent circuit model. Background technique [0002] Vibration energy harvesting devices can convert the vibration energy widely present in the environment into electrical energy. The energy conversion methods are divided into three types: electrostatic, electromagnetic and piezoelectric according to the different electromechanical conversion principles. The electrostatic type is realized by the capacity change of the variable capacitor due to vibration. The most attractive feature of this method is that it has IC compatibility, and it can be manufactured by silicon micro-processing technology and mass-produced. But in order to realize voltage constraint or charge constraint across the capacitor, independent power supply support is required. Ele...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/30G06F30/367G06F2119/06
Inventor 马建国赵升周绍华
Owner TIANJIN UNIV
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