Hollow structure forming method

Abstract

The invention relates to a hollow structure forming method. Including: apply solder stop flux between two or more core boards and stack them, heat up to the diffusion connection temperature, and pressurize to complete the diffusion connection; place panels on both sides of the diffusion-connected core board assembly Lamination, sealing and welding around the laminated blank components, and reserving the inner and outer gas paths; put the laminated blank components into the superplastic forming mold, and raise the temperature to a predetermined temperature lower than the diffusion connection temperature. Temperature, pressurized through the outer layer gas path, so that the outer layer panel is stretched outward under pressure to complete the superplastic forming; after the superplastic forming of the panel, deflate and relieve pressure through the outer layer gas path, and then pass through the inner layer gas path Ventilation and pressurization make the core plate extended and deformed under pressure to complete superplastic forming; after the core plate is superplastic formed, the temperature is raised to the diffusion connection temperature, and then heat preservation and pressure are maintained to complete the diffusion connection between the outer panel and the core plate.

Description

Technical field[0001]The present invention relates to the technical field of superplastic forming / diffusion bonding, in particular to a hollow structure forming method using superplastic forming / diffusion bonding technology.Background technique[0002]The superplastic forming / diffusion joining technology has the advantages of near net shape, good integrity, high rigidity, and large design freedom in the manufacture of hollow structural parts, and has a wide range of applications in aviation, aerospace and other fields. According to the number of layers required for structural manufacturing, the process structure can be divided into single-layer, two-layer, three-layer and four-layer structures, among which two-layer and four-layer structures are the most widely used. The rigidity and strength of the four-layer structure are more prominent, so it has become a choice in many lightweight structural designs, such as pelvic fins, rectifier blades, and rudder wing surfaces. For the four-lay...

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Problems solved by technology

[0003] At present, the most direct way to control the groove of the four-layer structure is to increase the thickness of the skin panel, and remove the excess thickness by mechanical processing or chemical milling after the formation is complete. This method not only wastes materials but also increases the process, resulting in production cycle. long

Another method is to use the same thickness of the sheet metal to prevent grooves by back pressure forming. This method is suitable for parts with large cavity sizes, but the process control is complicated. For parts with small cavity sizes or complex profiles The parts still cannot eliminate surface groove defects very well

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