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Ultrasonic guided wave defect positioning imaging method and system

An ultrasonic guided wave and imaging method technology, which is applied to the analysis of solids, instruments, and materials by using sonic/ultrasonic/infrasonic waves, which can solve the problem of unfavorable regular array sensor placement, inaccurate positioning and imaging, and positioning imaging methods that cannot achieve positioning compensation. and other problems to achieve the effect of improving positioning accuracy and improving engineering application value

Active Publication Date: 2019-01-18
CHINA SPECIAL EQUIP INSPECTION & RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the common layout methods for array imaging are linear array, square array and circular array. However, for complex working conditions, it is not conducive to the placement of regular array sensors; in addition, the existing ultrasonic guided wave defect positioning imaging method cannot achieve positioning compensation. , so that it is not possible to accurately position the imaging

Method used

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  • Ultrasonic guided wave defect positioning imaging method and system
  • Ultrasonic guided wave defect positioning imaging method and system
  • Ultrasonic guided wave defect positioning imaging method and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] figure 1 It is a flow chart of an ultrasonic guided wave defect positioning and imaging method implemented in the present invention. The present invention provides a ultrasonic guided wave defect positioning and imaging method. The method includes:

[0061] Step S1: Obtain the echo signals received by N transducer elements to form a full matrix time-domain echo signal; the N transducer elements are randomly arranged on the metal plate; the echo signals are for all generated by applying the excitation signal echo to the N transducer array elements;

[0062] Step S2: Using a rectangular time window function to intercept the damage scattering signal v in the full-matrix time-domain echo signal er (t);

[0063] Step S3: According to the damage scattering signal v er (t) Determine the amplitude intensity I(x,z) and phase intensity I of each imaging point φ (x,z);

[0064] Step S4: Calculate the amplitude intensity I(x, z) and phase intensity I of each imaging point φ (...

Embodiment 2

[0096] figure 2 It is a system structure diagram of ultrasonic guided wave defect positioning and imaging in Embodiment 2 of the present invention, as shown in figure 2 As shown, the present invention also provides an ultrasonic guided wave defect positioning imaging system, the system comprising:

[0097] The first acquisition module 1 is used to acquire echo signals received by N transducer array elements to form a full matrix time-domain echo signal; the N transducer array elements are randomly arranged on a metal plate; the echo The wave signal is generated by applying the excitation signal echo to the N transducer array elements;

[0098] An interception module 2, configured to intercept the damage scattering signal in the full-matrix time-domain echo signal by using a rectangular time window function;

[0099] An intensity determination module 3, configured to determine the amplitude intensity and phase intensity of each imaging point according to the damage scatteri...

Embodiment 3

[0121] The structural material properties of the aluminum plate to be tested are obtained, the structural size of the aluminum plate to be tested is 1000×1000×1 mm, and the dispersion curve is determined according to the structural material properties of the aluminum plate to be tested. The selected excitation signal is a 5-period 300KHz sinusoidal signal modulated by a Hanning window.

[0122] 9 piezoelectric array elements are randomly arranged on the aluminum plate to be tested, i.e. transducer array elements, and numbered (1-9) in sequence. The diameter of the piezoelectric array element is 6mm, and the thickness is 1mm. There are A penetrating crack defect of 10×2mm, such as image 3 shown.

[0123] Use the excitation signal selected above to excite the piezoelectric array elements 1-9 sequentially, and all the array elements receive signals at the same time during each excitation, until the piezoelectric array elements 1-9 are excited and received to obtain the full mat...

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Abstract

The invention discloses an ultrasonic guided wave defect positioning imaging method and system. The ultrasonic guided wave defect positioning imaging method comprises the following steps: obtaining echo signals received by N transducer array elements to form a full matrix time domain echo signal, wherein the N transducer array elements are randomly arranged on a metal plate; using a rectangular time window function to intercept damaged scatter signals in the full matrix time domain echo signal; determining amplitude intensity and phase intensity of each imaging point according to the damaged scatter signal; multiplying the amplitude intensity and the phase intensity of each imaging point to perform composite imaging to obtain a composite intensity value of each imaging point; determining an imaging graph according to the composite intensity value of each imaging point; and determining a metal plate defect according to the imaging graph, and performing positioning compensation on the metal plate defect. The invention effectively improves the positioning accuracy of the defects in the defect imaging graph, therefore, the invention has good engineering application value.

Description

technical field [0001] The invention relates to the technical field of nondestructive testing, in particular to an ultrasonic guided wave defect positioning imaging method and system. Background technique [0002] In industrial production, metal plate structures are widely used in aviation, aerospace, ships and other fields. Defects such as cracks, holes, and corrosion occur on the surface and back of the structure. Defects in sheet metal structures can be detected quickly and efficiently by using ultrasonic guided wave technology. At present, the common layout methods for array imaging are linear array, square array and circular array. However, for complex working conditions, it is not conducive to the placement of regular array sensors; in addition, the existing ultrasonic guided wave defect positioning imaging method cannot achieve positioning compensation. , so that the imaging cannot be accurately positioned. Contents of the invention [0003] The object of the pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/04
CPCG01N29/04G01N2291/0234G01N2291/106
Inventor 李光海范佳伟陆新元
Owner CHINA SPECIAL EQUIP INSPECTION & RES INST
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