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Water-soluble soldering flux and acid washing method of copper product

A water-soluble, flux technology, applied in the field of welding flux, can solve the problems of liquid tin splash, reduce the utilization rate of tin, a large amount of tin dross, etc., and achieve the effect of suppressing splash, improving the utilization rate, and reducing the adhesion residue.

Inactive Publication Date: 2019-01-25
WUYI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The traditional flux is hydrochloric acid solution. This kind of flux can completely remove impurities and oxides on the surface of the copper to be plated and improve the tinning effect. utilization rate

Method used

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  • Water-soluble soldering flux and acid washing method of copper product
  • Water-soluble soldering flux and acid washing method of copper product
  • Water-soluble soldering flux and acid washing method of copper product

Examples

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preparation example Construction

[0026] The present invention has no special requirements on the preparation method of the water-soluble soldering flux, preferably, the above-mentioned components are mixed according to the stated amounts and stirred evenly.

[0027] The present invention also provides a copper pickling method, comprising:

[0028] Mixing the water-soluble flux described in the above technical scheme with water to obtain pickling solution;

[0029] The copper material is pickled by using the pickling solution.

[0030] The present invention mixes the water-soluble flux described in the above technical solution with water to obtain pickling solution. In the present invention, the water is preferably deionized water. In the present invention, the mass ratio of the water-soluble flux to water is preferably 1:3-4, more preferably 1:3.2-3.7, and still more preferably 1:3.4-3.6.

[0031] After obtaining the pickling solution, the present invention uses the pickling solution to pickle the copper m...

Embodiment 1

[0037] Mix the components according to the dosage shown in Table 1 to obtain a water-soluble flux; mix the obtained water-soluble flux with water at a mass ratio of 1:3 to obtain a pickling solution.

[0038] Pass the copper wire through the pickling solution at a speed of 40m / min for pickling and then tinning. The interval between tinning and pickling is 1.05s, that is, the distance is 70cm; the temperature of the tin solution is 250-260°C.

Embodiment 2

[0040] Water-soluble flux was prepared according to the dosage in Table 1. The copper wire passed through the pickling solution at a speed of 45m / min, and the interval between pickling and tin plating was 0.9s. Others were the same as in Example 1.

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Abstract

The invention belongs to the technical field of welding auxiliary agents and in particular relates to a water-soluble soldering flux and an acid washing method of a copper product. The water-soluble soldering flux provided by the invention comprises organic acid, an alcohol-ether solvent and de-ionized water. The water-soluble soldering flux takes the organic acid as an active component and oxideand impurities on the surface of a part to the welded can be sufficiently removed under the action of the alcohol-ether solvent; adhesion residues of acidic substances on the surface of the part to the welded can be reduced. In a tin-plating process of the part to the welded, which is treated by the water-soluble soldering flux provided by the invention, splashing of tin liquid can be effectivelyinhibited and the utilization rate of tin is improved.

Description

technical field [0001] The invention belongs to the technical field of welding flux, and in particular relates to a water-soluble flux and a copper pickling method. Background technique [0002] Copper wire is a metal material that is widely used. When copper wire is used as a wire and cable material, it is usually covered with a protective layer of rubber on the surface of the copper wire to avoid the influence of the external environment on the copper wire. Metal copper is directly in contact with the rubber protective layer, which is prone to problems such as sticky rubber protective layer and blackened copper wire, which reduces the performance of the cable. Therefore, it is necessary to tin-plate the surface of the copper wire to increase the service life of the cable. [0003] The hot-dip tinning process has many advantages such as low equipment investment, high work efficiency, and simple operation. The required tin layer can be formed on the surface of copper by usin...

Claims

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Application Information

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IPC IPC(8): C23G1/10C23C2/08C23C2/02
CPCC23C2/08C23G1/103C23C2/024C23C30/00C09K13/00
Inventor 何文诗曾显华
Owner WUYI UNIV
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