Display backplane, manufacturing method thereof, and display device

A display backplane and thin film packaging technology, applied in the field of display backplanes and display devices, can solve the problems of limiting the popularity of OLED display backplanes, the display backplane needs to be improved, and corrosion damage.

Active Publication Date: 2019-01-25
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because OLED devices will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to choose a better packaging method for OLED devices.
At present, thin-film packaging is a packaging method widely used in the production of OLED display backplanes. This packaging method still has shortcomings that limit the popularity of OLED display backplanes.
[0003] Therefore, the current display backplane still needs to be improved

Method used

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  • Display backplane, manufacturing method thereof, and display device
  • Display backplane, manufacturing method thereof, and display device
  • Display backplane, manufacturing method thereof, and display device

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Embodiment Construction

[0025] Embodiments of the present invention are described in detail below. The embodiments described below are exemplary only for explaining the present invention and should not be construed as limiting the present invention. If no specific technique or condition is indicated in the examples, it shall be carried out according to the technique or condition described in the literature in this field or according to the product specification. The reagents or instruments used were not indicated by the manufacturer, and they were all commercially available conventional products.

[0026] The present invention is based on the following knowledge and findings of the inventors:

[0027] At present, the method of encapsulating the display backplane is usually to cover the OLED device with a thin-film encapsulation structure stacked with inorganic layers and organic layers, so as to achieve the purpose of blocking water and oxygen. Among them, the inorganic layer is used for water and ...

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Abstract

The invention provides a display backplane, a manufacturing method thereof and a display device. Wherein the display backplane comprises a substrate; A thin film transistor array disposed on one surface of the substrate; An ultraviolet light shielding layer arranged on a side of the thin film transistor array away from the substrate; A pixel bounding layer disposed on a side of the ultraviolet light shielding layer remote from the substrate; A thin film encapsulation layer disposed on a side of the pixel bounding layer remote from the substrate, wherein the pixel bounding layer contains a light conversion material capable of emitting ultraviolet light under excitation of infrared light. The inventors have found that the display backplane is simple in structure, easy to implement, and doesnot need to use an expensive ultraviolet photomask to reduce the production cost of the display backplane.

Description

technical field [0001] The present invention relates to the field of display technology, and in particular, to a display backplane, a manufacturing method thereof, and a display device. Background technique [0002] In recent years, OLED has gradually developed in the field of display and lighting technology, especially in the field of display, because of its advantages of high response, high contrast, and flexibility, it has broad application prospects. However, since the OLED device will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to select a better packaging method for the OLED device. At present, thin film encapsulation is a packaging method widely used in the production of OLED display backplanes. This packaging method still has shortcomings that limit the popularization of OLED display backplanes. [0003] Therefore, the current display backplane still needs to be improved. Contents of the invention [0004] The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32
CPCH10K59/00H10K59/126H10K59/122H10K59/12G02B5/208H01L27/1248H10K50/8445H10K2102/331G02B5/003H01L27/1218H10K50/84
Inventor 罗程远
Owner BOE TECH GRP CO LTD
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