micropore manufacturing method and a structure of a PCB substrate

Abstract

The invention relates to a micropore manufacturing method of a PCB substrate and a structure thereof, The method comprises the steps of, the first step is to make the circuit board, Step 2, baking thecircuit board in the first step; step 3, covering the dielectric layer on the top surface of the circuit board; step 4, opening a blind hole on the dielectric layer; step 5, setting a dielectric material block; step 6, setting a photoresist layer; step 7, opening a window hole in the photoresist layer; step 8, processing a microhole; and step 9, removing the photoresist layer to obtain a finishedproduct.

Description

technical field [0001] The invention relates to a method for opening holes in a PCB substrate and a hole structure thereof, in particular to a method capable of reducing the size of holes in a PCB substrate and a structure thereof. Background technique [0002] As we all know, with the development of electronic circuit technology, it is necessary to make more dense circuit layers on the PCB substrate of the same size to improve the integration of products and reduce the volume. In the current field of packaging PCB substrates, PCB substrates are developed. Holes are mainly opened by laser, and the minimum diameter of blind holes opened by laser is 50um. If you need to make holes smaller than 50um, such as 30um holes, you need to use special equipment, and the development and production costs of such equipment are extremely high. And there is no relevant equipment to be purchased at present. However, if a breakthrough cannot be made in the size of the opening, it is impossib...

AI Technical Summary

Problems solved by technology

[0002] As we all know, with the development of electronic circuit technology, it is necessary to make more dense circuit layers on the PCB substrate of the same size to improve the integration of products and reduce the volume. In the current field of packaging PCB substrates, PCB substrates are developed. Holes are mainly opened by laser, and the minimum diameter of blind holes opened by laser is 50um. If you need to make holes smaller than 50um, such as 30um holes, you need to use special equipment, and the development and production costs of such equipment are extremely high. And there is currently no related equipment that can be purchased

However, if the hole size cannot be broken through, it is impossible to produce ultra-high-density wiring packaging substrates, which is the main shortcoming of traditional technologies.

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