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Preparation method for black low-matte polyimide film

A technology of matt polyimide and polyamic acid resin, which is applied in the field of preparation of black low-matt polyimide film, can solve the problem of unsatisfactory dispersion effect of matt agent, unsatisfactory comprehensive performance, and insufficient comprehensive performance of the film Ideal and other issues, to achieve the effect of promoting matting effect, ideal comprehensive performance, low pinhole rate and gloss

Active Publication Date: 2019-01-29
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to current standards, the above-mentioned comprehensive properties are not ideal; from another perspective, the dispersion effect of the matting agent in the invention is not ideal, which leads to the unsatisfactory comprehensive properties of the obtained film.

Method used

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  • Preparation method for black low-matte polyimide film
  • Preparation method for black low-matte polyimide film
  • Preparation method for black low-matte polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1) 15 parts by weight of matting powder (porous silica with a pore volume of 2 mL / g and an average particle size of 5 μm) was mixed with 75 parts by weight of DMAc, and the resulting mixture was ultrasonically dispersed in an ultrasonic machine for 1 h, and then sent to Add 10 parts by weight of polyamic acid resin solution (solid content 20wt%), heat the obtained material to 120°C, then pour it into a high-speed shearing machine and cut it for 2 hours at a speed of 3000r / min to obtain dispersion A;

[0028] 2) Add 15 parts by weight of carbon black (average particle size of 20nm) to 45 parts by weight of DMAc, heat the resulting mixture to 50°C, place it in a three-roll mill and grind it for 30 minutes, then transfer the material to an ultrasonic machine In, 40 parts by weight of DMAc was added thereto, ultrasonically dispersed for 2h, to obtain a dispersion B with a carbon black concentration of 15wt%;

[0029] 3) Add 0.2kmol of ODA to 310kg of DMAc, stir for 0.5h, th...

Embodiment 2

[0031] Repeat Example 1, the difference is:

[0032] In step 1), the temperature of the obtained material is raised to 80° C. and then sheared and dispersed, and the time for shearing and dispersed is 4 hours;

[0033] In step 2), carbon black and DMAc are respectively 10 parts by weight and 40 parts by weight before grinding, and the grinding starts after being heated to 80° C. After the grinding is finished, 50 parts by weight of DMAc are added to finally obtain a carbon black concentration of 10 wt%. Liquid B;

[0034] Step 3) in, the add-on of control carbon black is 2wt% of the solid content of the polyamic acid resin solution synthesized in this step, and the add-on of matting powder is 10wt% of the polyamic acid resin solution solid content synthesized in this step %.

Embodiment 3

[0036] Repeat Example 1, the difference is:

[0037] In step 1), the amounts of matting powder, DMAc and polyamic acid resin solution are 12 parts by weight, 78 parts by weight and 10 parts by weight respectively, and the obtained material is heated to 140° C. for shear dispersion, and the time for shear dispersion is 3 hours ;

[0038] In step 2), the average particle size of carbon black is 30nm, and the obtained mixed solution is heated to 60°C, and placed in a three-roll mill for grinding for 60 minutes;

[0039] In step 3), the added amount of carbon black is controlled to be 9wt% of the solid content of the polyamic acid resin solution synthesized in this step.

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Abstract

The invention discloses a preparation method for a black low-matte polyimide film. The method comprises the following steps: 1) uniformly dispersing matting powder in an aprotic polar solvent, addinga polyamide acid resin solution into the obtained mixed liquid, heating the obtained material to 80-140 DEG C, and then performing shearing dispersion to obtain a dispersion liquid A, wherein the usage amount of the matting powder is 5-10 times the solid content of the polyamide acid resin solution used in the step; 2) uniformly dispersing carbon black in the aprotic polar solvent to obtain a dispersion liquid B; and 3) adding diamine and dianhydride into the aprotic polar solvent for polycondensation so as to obtain a polyamide acid resin solution, adding the dispersion liquid A and the dispersion liquid B into the polyamide acid resin solution, performing uniform mixing, and then successively carrying out defoaming, tape casting, drawing and thermal imidization so as to obtain the blacklow-matte polyimide film. The film prepared by using the method of the invention has excellent tensile strength and electrical strength, low pinhole ratio and gloss, and more ideal overall performance.

Description

technical field [0001] The invention relates to a polyimide film, in particular to a preparation method of a black low matte polyimide film. Background technique [0002] Polyimide (PI) films are widely used in the fields of optics, electronics, and aerospace due to their excellent mechanical properties, high and low temperature resistance, thermal dimensional stability, and electrical insulation properties. Due to the high surface gloss and high transparency of the traditional PI film, when it is used as the base material or cover film material of the flexible printed circuit board, it will cause glare or astigmatism and the distribution of the circuit design due to the existence of light reflection. The problem of plagiarism in the same industry, so the PI film is required to have low gloss, low light transmittance, etc. In addition to the advantages of traditional polyimide, matte black polyimide film also has good light-shielding properties, antistatic properties and lo...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08J3/20C08L79/08C08K7/26C08K3/04
CPCC08J3/2053C08J5/18C08J2379/08C08K3/04C08K7/26C08K2201/003
Inventor 冯羽风青双桂姬亚宁马纪翔白蕊刘姣
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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