Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Wafer transport system and transport method

A transfer system and transfer method technology, applied in the field of wafer transfer system, can solve the problem of inability to achieve compatible transfer of two sizes of wafers

Active Publication Date: 2019-02-01
长春长光圆辰微电子技术有限公司
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to solve the problem that the existing wafer transfer machine can only transfer wafers of one size, but cannot realize the compatible transfer of wafers of two sizes, and provide a transfer system and transfer method for wafers. method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer transport system and transport method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] The wafer transfer system includes: a box opening mechanism for an 8-inch wafer sealed box, a box-opening mechanism for a 12-inch wafer sealed box, a manipulator with an imaging unit; a control unit for controlling the manipulator and the box-opening mechanism.

[0048] According to the specific application environment, it is also necessary to be able to maintain a cleanliness level 1 microenvironment and the corresponding operation interface (display).

[0049] The specific transmission method is as follows:

[0050] 1) The operator places the sealing box containing the 8-inch wafer on the opening mechanism SMIF corresponding to the 8-inch wafer sealing box, and places the empty-load compatible sealing box on the Loadport of the 12-inch wafer opening mechanism;

[0051] 2) The two box opening mechanisms automatically open the SMIF Pod and Adapter FOUP respectively, and the scanning sensor on the robotic arm scans to confirm the number and position of wafers;

[0052] ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a wafer transport system and a transport method and belongs to the field of microelectronic technologies. The invention aims to solve the problem of failure to transmit wafers during the machining of wafers of different sizes by a wafer matching device of a specific size in the prior art. The transport system includes a first box opening mechanism for opening and closing a first wafer sealing box, a second box opening mechanism for opening and closing a second wafer sealing box, a mechanical arm for transferring wafers from the first wafer sealing box to the second firstwafer sealing box, and a control unit which is used for controlling the mechanical arm and the box opening mechanisms. With the wafer transport system and the transport method of the invention adopted, wafers of different sizes can be transferred between different sealing boxes; wafers of the same size can be also transferred between the same sealing boxes. The wafer transport system and the transport method can be suitable for the batched operation or batch-integrated operation of wafers of the same size, or the machining of wafers of different sizes on the wafer processing device of the specific size.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and in particular relates to a wafer transmission system and a transmission method. Background technique [0002] The integrated circuit industry uses a special sealed box that can isolate pollution to hold wafers (Wafer), and its specifications need to strictly follow the global unity. The International Organization for Semiconductor Equipment and Materials (SEMI) stipulates that the sealed box used for holding 12-inch wafers is FOUP (Front Opening Unified Pod, front-opening standard box), and the container for holding 8-inch wafers is provided by the entire factory. The initial design determines whether it is an open type or a sealed type. When using a sealed container, the box-opening mechanism SMIF (Standard Mechanical Interface) matching the production equipment is required. The corresponding sealed box for holding an 8-inch wafer is called SMIF Pod. Generally speaking, FOUP and SM...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677
CPCH01L21/67763
Inventor 黎大兵
Owner 长春长光圆辰微电子技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com