System for chemical and/or electrolytic surface treatment

Abstract

A system for chemical and / or electrolytic surface treatment of a substrate in a process fluid, a device for chemical and / or electrolytic surface treatment of a substrate in a process fluid, and a method for chemical and / or electrolytic surface treatment of a substrate in a process fluid are all described. The system for surface treatment comprises a basin, a fluid passage, an expansion tank, and acontrol unit. The basin is configured for the surface treatment of the substrate in the process fluid. The fluid passage links the basin and the expansion tank. The expansion tank is configured to hold an expansion volume of the process fluid. The control unit and the fluid passage are configured to maintain a level of the process fluid in the basin at an essentially constant level.

Description

technical field [0001] The invention relates to a system for the chemical and / or electrolytic surface treatment of a substrate in a process fluid, a device for the chemical and / or electrolytic surface treatment of a substrate in a process fluid, and a system for the chemical and / or electrolytic surface treatment of a substrate in a process fluid Methods of chemical and / or electrolytic surface treatment in process fluids Background technique [0002] In the semiconductor industry, various processes may be used to deposit material on or remove material from the surface of a wafer. [0003] For example, an electrochemical deposition (ECD) or electrochemical mechanical deposition (ECMD) process may be used to deposit conductors such as copper on a previously patterned wafer surface to fabricate device interconnect structures. [0004] Chemical mechanical polishing (CMP) is commonly used for the material removal step. Another technique, electropolishing or electroetching, can a...

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Problems solved by technology

[0009] However, this pre-wetting method is not optimal

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