Device and method utilizing laser light to induce compound stamping formation

A stamping forming and laser-induced technology, which is applied in the field of stamping forming of fine parts, can solve the problems of few scholars and achieve the effect of small laser energy, large forming depth and good forming area precision

Inactive Publication Date: 2019-02-12
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, there are many methods involved in the processing of micro parts, but in the field of laser processing, few scholars have carried out corresponding research on the processing of micro parts.

Method used

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  • Device and method utilizing laser light to induce compound stamping formation
  • Device and method utilizing laser light to induce compound stamping formation
  • Device and method utilizing laser light to induce compound stamping formation

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Embodiment Construction

[0019] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0020] like figure 1 As shown in the figure, a device for composite stamping and forming workpieces using laser-induced plasma shock waves and cavitation collapse shock waves, including a water tank 1 containing a liquid 2, a spacer 3, a molding micro-mold 4, a blank holder 7, and a lens group 9 and laser, the spacer 3, the blank holder 7 and the forming micro-mold 4 are all located in the liquid 2 of the water tank 1, the workpiece 5 is located above the forming micro-mould 4, and the blank holder 7 is located above the workpiece 5, the middle of the blank holder 7 has a longitudinal first through hole, the forming micro-mold 4 has a second through hole, and the bottom of the forming micro-mold 4 passes through the second through hole The cavity on the spacer block 3 is directly connected to the liquid 2 in the water tank 1 ; the lens group 9 is arranged ab...

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Abstract

The invention relates to a device and method utilizing laser light to induce compound stamping formation. The device comprises a flume; the flume is internally provided with a cushion block, a micro molding die and a blank holder; by utilizing laser-induced plasmas and a cavitation collapse-induced shock wave as a workpiece formation force source, a laser beam performs focusing in a through hole of the blank holder through a lens group, a laser focus point and the defocusing amount of the surface of a workpiece are regulated to enable the workpiece formation effect to reach the best effect, and the laser-induced plasmas and cavitation bubbles are sequentially produced on the surface of the workpiece; and the workpiece generates plastic deformation under the effects of a plasma shock wave and the cavitation collapse-induced shock wave, and finally, workpiece stamping formation is realized through the micro molding die. The method provided by the invention is a brand new compound formation method and greatly increases the stamping depth of the workpiece compared with a cavitation formation method; and meanwhile, due to underwater formation, compared with laser impact formation, the method can reduce the influence of the laser thermal effect to the maximum and ensures the surface formation quality of the workpiece.

Description

technical field [0001] The invention relates to the technical field of stamping and forming of fine parts, in particular to a device and method for stamping and forming fine parts by using laser-induced plasma shock waves and cavitation collapse shock waves. Background technique [0002] With the rapid development of microelectromechanical systems and computer technology, such as electronic components, as well as medical, aerospace, military and other fields, the need for product miniaturization is getting higher and higher, the miniaturization of instruments and equipment products and their rapid and high-precision manufacturing become the current research hotspot. However, in the field of micro-parts processing technology, it has always been a technical difficulty in my country's manufacturing and processing industry. At present, there are many methods involved in the processing of micro-parts, but in the field of laser processing, few scholars have carried out correspond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D26/06B21D26/00
CPCB21D26/00B21D26/06
Inventor 任旭东张洪峰罗春晖吴柯唐金科栾小康石佑敏陆聪
Owner JIANGSU UNIV
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