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A kind of power element encapsulation module and preparation method thereof

A technology for power components and packaging modules, applied in the field of power component packaging modules and their preparation, to achieve the effects of improving thermal conductivity and shock resistance, eliminating influence and improving thermal insulation performance

Active Publication Date: 2020-10-13
北京名动晶华科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While the heat dissipation performance of the existing intelligent power modules needs to be further improved, at the same time, it is necessary to ensure that it has excellent sealing performance and moisture-proof performance. focus on

Method used

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  • A kind of power element encapsulation module and preparation method thereof
  • A kind of power element encapsulation module and preparation method thereof

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preparation example Construction

[0029] The present invention also proposes a method for preparing the above-mentioned power element packaging module, which includes the following steps:

[0030] 1) A resin base is provided, and a first annular concave hole is formed on the peripheral edge of the lower surface of the resin base. The material of the resin base is one of PET, PEN, ABS, PMMA and PC, formed by a cutting process The first annular concave hole, the depth of the first annular concave hole is 1-1.5 mm, improves the tightness of the first heat-insulating sealant layer formed subsequently and the resin substrate, thereby improving the reliability of the entire power element packaging module. Sealing performance and moisture-proof performance;

[0031] 2) bonding a heat-conducting silica gel layer on the upper surface of the resin base to improve the heat conduction performance and shock resistance of the entire power element packaging module;

[0032] 3) Deposit an insulating material on the thermally...

Embodiment 1

[0041] The present invention proposes a method for preparing a power element packaging module, comprising the following steps:

[0042] 1) A resin base is provided, and a first annular concave hole is formed on the peripheral edge of the lower surface of the resin base. The material of the resin base is ABS, and the first annular concave hole is formed by a cutting process. The first The depth of the annular recess is 1.2 mm;

[0043] 2) bonding a heat-conducting silica gel layer on the upper surface of the resin base;

[0044] 3) Depositing an insulating material on the thermally conductive silica gel layer to form an insulating layer, depositing boron nitride by PECVD to form the insulating layer, and the thickness of the insulating layer is 100 microns;

[0045] 4) forming a circuit wiring layer on the insulating layer, the specific steps are: bonding copper foil on the insulating layer, and removing part of the copper foil through an etching process to form the circuit wi...

Embodiment 2

[0053] The present invention proposes a method for preparing a power element packaging module, comprising the following steps:

[0054] 1) A resin base is provided, and a first annular concave hole is formed on the peripheral edge of the lower surface of the resin base. The material of the resin base is PC, and the first annular concave hole is formed by a cutting process. The first The depth of the annular recess is 1.5 mm;

[0055] 2) bonding a heat-conducting silica gel layer on the upper surface of the resin base;

[0056] 3) Depositing an insulating material on the thermally conductive silica gel layer to form an insulating layer, depositing aluminum oxide by ALD to form the insulating layer, the thickness of the insulating layer is 150 microns;

[0057] 4) forming a circuit wiring layer on the insulating layer, the specific steps are: bonding copper foil on the insulating layer, and removing part of the copper foil through an etching process to form the circuit wiring l...

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Abstract

The invention relates to a power component packaging module and a method for preparing the same. The method includes steps of arranging a heat conduction silica gel layer, an insulating layer and a circuit wiring layer on a resin substrate; embedding a heat-insulation type plastic frame in the resin substrate; dividing the circuit wiring layer into a first region and a second region; assembling adriving component and corresponding first pins in the first region of the circuit wiring layer and assembling a power component and corresponding second pins in the second region of the circuit wiringlayer; forming a first heat-insulation sealant layer, a first heat conduction sealant layer, a second heat conduction sealant layer and a second heat-insulation sealant layer; embedding a first heatdissipation block and a second heat dissipation block in the upper side and the lower side of the power component. The power component packaging module and the method have the advantage that the powercomponent packaging module prepared by the aid of the method is excellent in comprehensive performance, good in stability and long in service life.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a power element packaging module and a preparation method thereof. Background technique [0002] Intelligent power module is a power drive semiconductor power device package that combines power electronics and integrated circuit technology. In the existing intelligent power modules, in order to improve the heat dissipation performance of the intelligent power module, the commonly used methods are: one method is to set a heat insulation structure in the metal packaging substrate to prevent the heat from spreading laterally, and the other method is to A high thermal conductivity block is placed in a low thermal conductivity package substrate. While the heat dissipation performance of the existing intelligent power modules needs to be further improved, at the same time, it is necessary to ensure that it has excellent sealing performance and moisture-proof performanc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/56H01L25/16H01L23/367H01L23/373H01L23/29H01L23/31
CPCH01L21/50H01L21/56H01L23/295H01L23/3135H01L23/367H01L23/3737H01L25/16
Inventor 管先炳
Owner 北京名动晶华科技有限公司
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