Graphene-copper composite heat-dissipating film as well as preparation method and application thereof

A technology of composite heat dissipation film and graphene film, applied in the direction of graphene, applications, other household appliances, etc., can solve the problems of many defects, poor thermal conductivity and flexibility of macro-materials, etc. Outstanding cooling performance

Active Publication Date: 2019-02-15
宁波顶峰机器人有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, the existing exfoliated graphene sheets are small and have many defects, and the thermal conductivity and flexibility of the assembled macroscopic materials are not good.

Method used

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  • Graphene-copper composite heat-dissipating film as well as preparation method and application thereof
  • Graphene-copper composite heat-dissipating film as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Embodiment 1 proposes a kind of graphene-copper composite cooling film, and its preparation method comprises the steps:

[0016] S101: first pretreating natural graphite, and then sequentially undergoing high-speed shearing, ultrasonic stripping and emulsification to obtain graphene.

[0017] S102: The graphene mixture obtained in the step S101 is prepared into a film and dried to obtain a graphene film, and then the graphene film is heated at a temperature of 2900° C. to prepare micro-airbags, and then mechanically The micro-airbags were rolled to produce micro-folds.

[0018] S103: Compacting the graphene film treated in step S102 with the copper foil, and then pasting the thermally conductive black film on the other side of the copper foil to obtain a graphene-copper composite heat dissipation film with a thickness of 25 μm.

Embodiment 2

[0020] Embodiment 2 proposes a kind of graphene-copper composite cooling film, and its preparation method comprises the steps:

[0021] S101: first pretreating natural graphite, and then sequentially undergoing high-speed shearing, ultrasonic stripping and emulsification to obtain graphene.

[0022] S102: The graphene mixture obtained in the step S101 is prepared into a film and dried to obtain a graphene film, and then the graphene film is heated at a temperature of 3100° C. The micro-airbags were rolled to produce micro-folds.

[0023] S103: compacting the graphene film treated in step S102 with the copper foil, and then pasting the thermally conductive black film on the other side of the copper foil to obtain a graphene-copper composite heat dissipation film with a thickness of 150 μm.

Embodiment 3

[0025] Embodiment 3 proposes a kind of graphene-copper composite cooling film, and its preparation method comprises the steps:

[0026] S101: first pretreating natural graphite, and then sequentially undergoing high-speed shearing, ultrasonic stripping and emulsification to obtain graphene.

[0027] S102: The graphene obtained in the step S101 is mixed, then prepared into a film and dried to obtain a graphene film, and then the graphene film is heated at a temperature of 3000°C to prepare a micro-airbag, and then mechanically The micro-airbags were rolled to produce micro-folds.

[0028] S103: Compacting the graphene film treated in step S102 with the copper foil, and then pasting the thermally conductive black film on the other side of the copper foil to obtain a graphene-copper composite heat dissipation film with a thickness of 80 μm.

[0029] Table 1: Parameters of thermally conductive black film

[0030]

[0031] In the new material laboratory of the Yangpu District ...

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Abstract

The invention relates to a graphene-copper composite heat-dissipating film as well as a preparation method and application thereof. The preparation method comprises the following steps: firstly, pretreating natural graphite, and then sequentially performing high-speed shearing, ultrasonic stripping and emulsification to obtain graphene; mixing the graphene, then preparing the graphene into a film,drying to obtain a graphene film, then heating the graphene film at a preset temperature to prepare a micro-balloon, and mechanically rolling the micro-balloon at a preset pressure to prepare micro-pleats; compacting the graphene film with copper foil, and then sticking a heat-conductive black film onto the other side of the copper foil to obtain the graphene-copper composite heat-dissipating film. According to the preparation method of the graphene-copper composite heat-dissipating film provided by the invention, the heat dissipation is accelerated by equalizing a point-like heat source to asurface and then emitting the heat in a longitudinal direction, so that a protection effect on a product component is achieved, and the heat dissipation effect is superior to that of graphite sheetsin the traditional process and artificial graphite sheets.

Description

technical field [0001] The invention belongs to the field of material processing and preparation, and in particular relates to a graphene-copper composite heat dissipation film and its preparation method and application. Background technique [0002] Graphene is a two-dimensional material with a hexagonal honeycomb lattice composed of carbon atoms in sp2 hybridized orbitals and a thickness of only one carbon atom. Graphene is currently the thinnest but also the hardest nanomaterial in the world. It is almost completely transparent and only absorbs 2.3% of light; its thermal conductivity is as high as 5300W / m K, higher than that of carbon nanotubes and diamonds, and its electron mobility at room temperature exceeds 15000cm 2 / V·s is higher than carbon nanotubes or silicon crystals, and the resistivity is only about 10Ω·m~8Ω·m, which is lower than copper or silver, and is the material with the smallest resistivity in the world. Electronic appliances generate heat during oper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B15/20B32B37/06B32B37/10C01B32/19C01B32/194
CPCB32B9/007B32B9/041B32B15/20B32B37/06B32B37/10B32B2551/00C01B32/19C01B32/194
Inventor 陈海英周舟卞正国
Owner 宁波顶峰机器人有限公司
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