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A kind of composite anti-anti-oxygen polyimide film and its application

A technology of anti-atomic oxygen polyimide and composite film, which is applied in the field of functional polyimide film, can solve the problems that cannot meet the application requirements of space vehicles, achieve excellent optical transparency, avoid performance degradation, and improve anti-atomic properties. The effect of oxygen performance

Active Publication Date: 2021-05-14
JIAXING RAYITEK FILM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, neither the POSS modified PI film nor the intrinsic anti-atomic oxygen PI film can meet the application requirements of space vehicles for long-life anti-atomic oxygen films, and new methods and technologies need to be sought.

Method used

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  • A kind of composite anti-anti-oxygen polyimide film and its application
  • A kind of composite anti-anti-oxygen polyimide film and its application
  • A kind of composite anti-anti-oxygen polyimide film and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Embodiment 1TSP-POSS content is the TSP-POSS / PI composite film (m=5) of 5wt%

[0061] Dissolve 10g of PI resin in 37.1g of DMAc to prepare PI solution A; dissolve 0.5263g of TSP-POSS in 5g of DMAc to prepare TSP-POSS solution B; fully mix solution A and solution B under mechanical stirring and filter , standing defoaming, the obtained solid content is 20wt% TSP-POSS / Pl composite resin solution, TSP-POSS content accounts for 5wt% of TSP-POSS / PI composite film total amount. The prepared solution was uniformly coated on a clean glass plate by an automatic film coating machine, placed in a 100-class clean program temperature-controlled drying oven, and cured according to the following program: 50°C / 0.5h; 80°C / 3h; 120°C ℃ / 1h; 150℃ / 1h; 180℃ / 1h; 250℃ / 1h. Naturally cool to room temperature. The glass plate was soaked in deionized water, and peeled off to obtain the PI composite film.

[0062] The TSP-POSS content that obtains is that the TSP-POSS / PI composite film of 5wt% us...

Embodiment 2

[0065] Embodiment 2TSP-POSS content is the TSP-POSS / PI composite film (m=10) of 10wt%

[0066] Dissolve 10g of PI resin in 39.4g of DMAc to prepare PI solution A; dissolve 1.1111g of TSP-POSS in 5g of DMAc to prepare TSP-POSS solution B; fully mix solution A and solution B under mechanical stirring and filter, Standing for defoaming, the TSP-POSS / PI composite resin solution with a solid content of 20wt% was obtained, and the TSP-POSS content accounted for 10wt% of the total amount of the TSP-POSS / Pl composite film. The prepared solution was uniformly coated on a clean glass plate by an automatic film coating machine, placed in a 100-class clean program temperature-controlled drying oven, and cured according to the following program: 50°C / 0.5h; 80°C / 3h; 120°C ℃ / 1h; 150℃ / 1h; 180℃ / 1h; 250℃ / 1h. Naturally cool to room temperature. The glass plate was soaked in deionized water, and peeled off to obtain the PI composite film.

[0067] The TSP-POSS content that obtains is that the ...

Embodiment 3

[0071] Embodiment 3TSP-POSS content is the TSP-POSS / PI composite film (m=15) of 15wt%

[0072] Dissolve 10g of PI resin in 42.1g of DMAc to prepare PI solution A; dissolve 1.7647g of TSP-POSS in 5g of DMAc to prepare TSP-POSS solution B; fully mix solution A and solution B under mechanical stirring and filter, Standing for defoaming, a TSP-POSS / PI composite resin solution with a solid content of 20wt% was obtained, and the TSP-POSS content accounted for 15wt% of the total amount of the TSP-POSS / PI composite film. The prepared solution was uniformly coated on a clean glass plate by an automatic film coating machine, placed in a 100-class clean program temperature-controlled drying oven, and cured according to the following program: 50°C / 0.5h; 80°C / 3h; 120°C ℃ / 1h; 150℃ / 1h; 180℃ / 1h; 250℃ / 1h. Naturally cool to room temperature. The glass plate was soaked in deionized water, and peeled off to obtain the PI composite film.

[0073] The TSP-POSS content that obtains is that the TS...

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PUM

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Abstract

The invention discloses a composite type antigenic oxygen polyimide film and a preparation method and application thereof. The film is composed of the intrinsic antigenic oxygen PI polymer shown in formula I and the TSP-POSS shown in formula II according to a certain ratio The composite resin solution and the composite film prepared from the resin solution; the mass percentage of TSP-POSS in the total TSP-POSS / PI composite film is m%, where: an integer of 0<m≤30. The film has dual proton oxygen properties. The PI matrix film itself has the characteristic of intrinsic proton oxygen due to the phosphorus element. The composite film formed by adding TSP-POSS significantly enhances its antigenic oxygen properties. Due to the formation of molecular-level recombination between TSP‑POSS and the PI matrix, the composite film maintains the excellent optical transparency of the PI film matrix. The polyimide composite film of the invention covers the outer surface of the transparent aerospace equipment exposed in space, and can effectively improve its proton oxygen performance.

Description

technical field [0001] The invention relates to the field of functional polyimide films, in particular to a cage polyimide anti-atomic oxygen film compounded with polysilsesquioxane (POSS). Background technique [0002] Most spacecraft operate in low earth orbit (LEO), which is 200-700km above the ground. There are many environmental factors affecting the operation and working life of spacecraft at this orbital altitude, such as thermal cycle, space debris, ultraviolet radiation and space atomic oxygen, among which atomic oxygen (AO) has been proved to be the most important and dangerous influencing factors. The spacecraft in low earth orbit collides with the atomic oxygen in the orbit, its relative velocity is about 8km / s, and the impact impulse is about 10 14 ~10 15 / cm 2 · s, the impact energy of about 4-5eV will be generated on the surface of the spacecraft, which is enough to cause chemical bond breaking and oxidation of most organic materials on the surface of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08L83/06C08G73/10C08J5/18
CPCC08G73/1007C08G73/1039C08G73/1057C08G73/1071C08J5/18C08J2379/08C08J2483/04
Inventor 刘金刚张燕武晓郭晨雨姜岚岚齐麟
Owner JIAXING RAYITEK FILM TECH CO LTD