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Package structure of electronic product and preparation method thereof

A technology of electronic products and packaging structures, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of destroying electronic products, affecting performance, and many surface defects of thin films

Inactive Publication Date: 2019-02-15
SHANGHAI MI FANG ELECTRONICS LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the film prepared by plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) has good water barrier properties, but the film has many surface defects, and because of its high rigidity, it cannot be widely used in the packaging of flexible film products.
In addition, the current technical method is to coat polysilazane (PSZ) solution on the surface of flexible organic solar cells, and then cure the polysilazane solution by ultraviolet light curing or heat curing. In the process of packaging, electronic products need to withstand high temperature and ultraviolet light, which will damage electronic products and affect their performance

Method used

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  • Package structure of electronic product and preparation method thereof
  • Package structure of electronic product and preparation method thereof

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Embodiment Construction

[0024] The present invention is described below based on examples, but the present invention is not limited to these examples. In the following detailed description of the invention, some specific details are set forth in detail. The present invention can be fully understood by those skilled in the art without the description of these detailed parts. In order not to obscure the essence of the present invention, well-known methods, procedures, procedures, components and circuits have not been described in detail.

[0025] Additionally, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

[0026] Unless the context clearly requires, throughout the specification and claims, "comprises", "comprises" and similar words should be interpreted in an inclusive sense rather than an exclusive or exhaustive meaning; that is, "including but not limited to" meaning. In the description of...

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Abstract

The invention discloses a package structure of an electronic product and a preparation method thereof. An embodiment of the preparation method comprises the steps of firstly preparing a barrier film including a substrate and a barrier layer which are sequentially stacked; and then fixing the barrier film on a surface of the electronic product by use of a bonding layer and a sealant to package theelectronic product. A condition that high temperature or strong ultraviolet light treatment is directly performed on the device is avoided, an influence of a package process on the device performanceis reduced; and the process is simple and suitable for large-area continuous production.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a packaging structure of electronic products and a preparation method thereof. Background technique [0002] Due to the depletion of non-renewable energy, efficient use of renewable energy technology is the only way to solve the problem of energy depletion. Photovoltaic technology is one of the most important technologies at present, and is valued by researchers. A flexible organic solar cell (Flexible Organic Solar Cell, FOSC) is an organic solar cell (Organic Solar Cell, OSC) made of an organic semiconductor as an active layer and a flexible material as a substrate. This battery has the characteristics of light weight, simple process, low cost, and large-area preparation. It is suitable for photovoltaic building integration and other facilities, so it has become one of the research hotspots in the field of photovoltaic technology in recent years. [0003] An urgent problem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/44H01L51/48
CPCH10K71/50H10K30/88Y02E10/549
Inventor 王家林李胜夏
Owner SHANGHAI MI FANG ELECTRONICS LTD
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