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Epoxy resin composition

A technology of epoxy resin and composition, which is applied in the field of epoxy resin composition, can solve the problems of void operability, defects, small reaction heat, etc., and achieve the effects of excellent fluidity and fluidity, and excellent adhesion

Active Publication Date: 2019-02-26
KCC CORP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even if the filling property is excellent and the workability is improved, the epoxy resin may have defects such as bleeding and overflow after filling
If the heat of reaction is small and sufficient volatilization and air bubble removal cannot be accomplished, voids may be generated and operability defects may occur

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
  • Epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] The composition (parts by weight) shown in Table 1 below used the epoxy resin, inorganic filler, curing agent, and additives to prepare an epoxy resin composition.

[0073] Specifically, an epoxy resin mixture of an amine curing agent, a low-viscosity epoxy resin, and a multifunctional epoxy resin was mixed in a planetary mixer. Silica and carbon black with an average particle diameter of about 0.3 μm are put into a planetary mixer and mixed, and additives such as a silane compound, a dispersant, and an antifoaming agent are added to the mixture and stirred to prepare an epoxy resin combination.

Embodiment 2

[0075] An epoxy resin composition was prepared by performing the same method as in Example 1 except that the amounts of the epoxy resin and the inorganic filler were changed as shown in Table 1 below.

Embodiment 3

[0077] An epoxy resin composition was prepared by performing the same method as in Example 1 except that the amounts of the epoxy resin and the inorganic filler were changed as shown in Table 1 below.

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Abstract

The present invention provides an epoxy resin composition which comprises epoxy resin, an inorganic filling material, and a hardening agent. The epoxy resin is epoxy mixed resin having low viscosity epoxy resin of which viscosity is 500-4,000 cps at 25 DEG C and multifunctional epoxy resin more than 3 functions. An average size of the inorganic filling material is 0.1-5 [mu]m.

Description

technical field [0001] The present invention relates to an epoxy resin composition. Background technique [0002] According to the miniaturization, thinning, and multi-functionalization of electronic products, the sealing method and construction method of semiconductor devices are also diversified. In particular, surface mount technology has become the mainstream of conventional pin-type methods, and as one surface mount packaging technology, there is a flip-chip mounting type. This type is a technology that enables miniaturization and thinning by connecting the surface of the chip to the substrate by solder balls or solder bumps, not by a wire connection method as usual. [0003] However, if a thermal shock test is performed on a flip-chip package mounted by such a method, it will be found that thermal stress is caused due to the difference in thermal expansion coefficient between the chip, wiring board and solder balls, so that the thermal stress on the circuit board and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/36C08K3/04
CPCC08K2201/003C08L63/00C08L2205/025C08K3/36C08K3/04C08G59/28C08G59/38C08G59/4042C08K2201/005
Inventor 徐浩然李恩贞李欢希
Owner KCC CORP CO LTD
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