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Evaporation device and evaporation method

A technology of evaporation and evaporation materials, which is applied in the directions of vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of crosstalk of different evaporation materials, achieve guaranteed performance, reduce costs, and reduce volume Effect

Active Publication Date: 2019-03-05
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides an evaporation device and an evaporation method, which are used to solve the problem of crosstalk between different evaporation materials caused by the existing evaporation device

Method used

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  • Evaporation device and evaporation method
  • Evaporation device and evaporation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] combine figure 1 with figure 2 As shown, this embodiment provides an evaporation device for evaporating patterns of multiple film layers on the substrate 2 to be evaporated. The vapor deposition device includes:

[0044] Evaporation chamber 1;

[0045] A plurality of evaporation sources 3 arranged in the evaporation chamber 1, each evaporation source 3 is used to generate evaporation material particles 4, and the evaporation material particles 4 produced by different evaporation sources 3 are different;

[0046] A conductive partition 6 is arranged between two adjacent evaporation sources 3, and the conductive partition 6 is used to divide the evaporation chamber 1 into a plurality of sub-evaporation chambers 100, and the evaporation sources 3 are arranged in the sub-chambers one by one. In the evaporation chamber 100;

[0047] a charge supply module, configured to control the charges of the first polarity on the conductive separator 6;

[0048] Each sub-evaporati...

Embodiment 2

[0081] This embodiment provides a method for vapor deposition using the vapor deposition device in Embodiment 1, which is used to vapor deposit patterns of multiple film layers on the substrate to be vapor deposited. combine Figure 1-3 Shown, described vapor deposition method comprises:

[0082] Control the charge of the first polarity on the conductive spacer 6, the conductive spacer 6 is arranged between two adjacent evaporation sources 3, divides the evaporation chamber 1 into a plurality of sub-evaporation chambers 100, and the evaporation sources 3 correspond to each other set in the sub-evaporation chamber 100;

[0083] Control the evaporation source 3 to generate evaporation material particles 4;

[0084] The vapor deposition material particles 4 generated by controlling the evaporation source 3 are charged with the first polarity, and the charged vapor deposition material particles 4 are evaporated on the substrate 2 under the repulsive force between the same charge...

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PUM

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Abstract

The invention relates to the technical field of film preparation, and discloses an evaporation device and an evaporation method. According to the evaporation device, an evaporation cavity is divided by electric conduction separating plates into a plurality of sub evaporation cavities, evaporation sources are arranged in the sub evaporation cavities in a one-to-one corresponding manner, and the electric conduction separating plates are controlled by a charge supply module to be electrified; and evaporation material particles are controlled by a microparticle electrification module to be electrified, and the electric conduction separating plates and the evaporation material particles carry electric charges in the same kind, so that the evaporation angle of the evaporation material particlesis reduced under the action of the repulsive force between the same-kind electric charges of the evaporation material particles and the electric conduction separating plate, crosstalk of the evaporation material particles evaporated by the different evaporation sources is avoided, and the evaporation quality is improved. Meanwhile, more evaporation material particles can be evaporated on a substrate, and the material utilization rate is improved. Moreover, the volume of the device can be reduced, the time wasted by the evaporation process can be shortened, the production efficiency can be improved, the cost can be reduced, and the performance of the prepared substrate can be ensured. The method of performing evaporation by using the evaporation device also has the above-described technicaleffects.

Description

technical field [0001] The invention relates to the technical field of film preparation, in particular to an evaporation device and an evaporation method. Background technique [0002] At present, displays are developing in the direction of large-scale, ultra-thin, high-resolution, high-brightness, and low-power consumption. In recent years, organic light emitting diode (OLED) has become a very popular emerging flat-panel display product at home and abroad, because OLED display has self-illumination, wide viewing angle, short response time, high luminous efficiency, wide color gamut, low It has the characteristics of working voltage, thin panel, large-size and flexible panel and simple manufacturing process, and it also has the potential of low cost. [0003] Generally, a variety of different organic light-emitting materials are required to make large-size OLEDs, so a corresponding number of evaporation sources is required. The traditional OLED organic evaporation chamber i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C23C14/04H10K99/00
CPCC23C14/04C23C14/24H10K71/164C23C14/543C23C14/32C23C14/12C23C14/568C23C14/243C23C14/042C23C14/325C23C14/548C23C14/048H10K50/11H10K50/80H10K50/844H10K71/00
Inventor 毛波江昌俊李俊哈朗朗窦义坤徐阳栾梦雨
Owner BOE TECH GRP CO LTD