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A vapor deposition device and vapor deposition method

A technology of evaporation and evaporation materials, which is applied in the directions of vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of crosstalk of different evaporation materials, achieve guaranteed performance, reduce volume, and reduce costs Effect

Active Publication Date: 2020-12-04
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides an evaporation device and an evaporation method, which are used to solve the problem of crosstalk between different evaporation materials caused by the existing evaporation device

Method used

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  • A vapor deposition device and vapor deposition method
  • A vapor deposition device and vapor deposition method
  • A vapor deposition device and vapor deposition method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] combine figure 1 and figure 2 As shown, this embodiment provides an evaporation device for evaporating patterns of multiple film layers on the substrate 2 to be evaporated. The vapor deposition device includes:

[0044] Evaporation chamber 1;

[0045] A plurality of evaporation sources 3 arranged in the evaporation chamber 1, each evaporation source 3 is used to generate evaporation material particles 4, and the evaporation material particles 4 produced by different evaporation sources 3 are different;

[0046] A conductive partition 6 is arranged between two adjacent evaporation sources 3, and the conductive partition 6 is used to divide the evaporation chamber 1 into a plurality of sub-evaporation chambers 100, and the evaporation sources 3 are arranged in the sub-chambers one by one. In the evaporation chamber 100;

[0047] a charge supply module, configured to control the charges of the first polarity on the conductive separator 6;

[0048] Each sub-evaporatio...

Embodiment 2

[0081] This embodiment provides a method for vapor deposition using the vapor deposition device in Embodiment 1, which is used to vapor deposit patterns of multiple film layers on the substrate to be vapor deposited. to combine Figure 1-3 Shown, described vapor deposition method comprises:

[0082] Control the charge of the first polarity on the conductive spacer 6, the conductive spacer 6 is arranged between two adjacent evaporation sources 3, divides the evaporation chamber 1 into a plurality of sub-evaporation chambers 100, and the evaporation sources 3 correspond to each other set in the sub-evaporation chamber 100;

[0083] Control the evaporation source 3 to generate evaporation material particles 4;

[0084] The vapor deposition material particles 4 generated by controlling the evaporation source 3 are charged with the first polarity, and the charged vapor deposition material particles 4 are evaporated on the substrate 2 under the repulsive force between the same cha...

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Abstract

The invention relates to the technical field of film preparation, and discloses an evaporation device and an evaporation method. The evaporation device divides the evaporation chamber into a plurality of sub-evaporation chambers through conductive partitions, and sets evaporation sources in each sub-evaporation chamber one by one, and controls the charging of the conductive partitions through the charge supply module. The particle charging module controls the charging of the evaporation material particles, and the conductive separator and the evaporation material particles are charged with the same kind of charge, so that the evaporation material particles are reduced by the repulsive force between the same charges of the conductive separator. The evaporation angle of the coating material particles can avoid crosstalk between the evaporation material particles evaporated by different evaporation sources, and improve the evaporation quality. At the same time, more evaporation material particles can be evaporated on the substrate, thereby improving material utilization. Moreover, the volume of the equipment can be reduced, the time consumption of the vapor deposition process can be shortened, the production efficiency can be improved, the cost can be reduced, and the performance of the obtained substrate can be guaranteed. The method of vapor deposition using the above vapor deposition device also has the above technical effects.

Description

technical field [0001] The invention relates to the technical field of film preparation, in particular to an evaporation device and an evaporation method. Background technique [0002] At present, displays are developing in the direction of large-scale, ultra-thin, high-resolution, high-brightness, and low-power consumption. In recent years, organic light emitting diode (OLED) has become a very popular emerging flat-panel display product at home and abroad, because OLED display has self-illumination, wide viewing angle, short response time, high luminous efficiency, wide color gamut, low It has the characteristics of working voltage, thin panel, large-size and flexible panel and simple manufacturing process, and it also has the potential of low cost. [0003] Generally, a variety of different organic light-emitting materials are required to make large-size OLEDs, so a corresponding number of evaporation sources is required. The traditional OLED organic evaporation chamber i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24C23C14/04H10K99/00
CPCC23C14/04C23C14/24H10K71/164C23C14/543C23C14/32C23C14/12C23C14/568C23C14/243C23C14/042C23C14/325C23C14/548C23C14/048H10K50/11H10K50/80H10K50/844H10K71/00
Inventor 毛波江昌俊李俊哈朗朗窦义坤徐阳栾梦雨
Owner BOE TECH GRP CO LTD