Decompression drying equipment

Abstract

An embodiment of the invention discloses decompression drying equipment. The decompression drying device comprises a sealing chamber, an air pressure regulation device and a bearing platform arrangedin the sealing chamber, wherein the bearing platform is used for bearing a substrate whose surface is coated with a photoresist; the air pressure regulation device is arranged on the side edge of thesealing chamber; the air pressure regulation device comprises a main air pipe and a branch pipe which are used for introducing protective gas into the sealing chamber; the branch air pipe is connectedto the main air pipe; and the main air pipe is longitudinally symmetrical on the surface of the side edge of the sealing chamber. The design of the longitudinally symmetrical main air pipe is adoptedin the embodiment of the invention, so that an air supply distance of the branch air pipe is shortened, and the airflow pressure drop is reduced, and thus the upper air pressure and the lower air pressure are stable, and the product characteristics are stable.

Description

technical field [0001] The invention relates to the technical field of semiconductor production equipment, in particular to a decompression drying equipment. Background technique [0002] In the substrate manufacturing process of TFT-LCD (Thin Film Transistor-Liquid Crystal Display, referred to as Thin Film Transistor-Liquid Crystal Display), vacuum decompression drying (Vacuum Dry, referred to as VCD) is an important process. Vacuum decompression drying is to perform decompression drying treatment on the substrate coated with the coating liquid of the film layer such as photoresist, so that the film layer is cured. [0003] The complete photolithography process completes the definition of precise patterns on the substrate through the three main steps of photoresist coating process, exposure process, and development process. In the decompression drying process after the coating process, the substrate coated with photoresist is placed in a sealed chamber, and the sealed cham...

AI Technical Summary

Problems solved by technology

The photoresist itself is liquid and has a certain fluidity. When the air supply pressure of the decompression drying equipment is unstable, the photoresist may flow in a small range when the airflow passes through the surface of the substrate, so that the thickness of the photoresist on the surface of the glass substrate Inhomogeneity occurs, affecting product characteristics

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