Sealed temperature sensor

A temperature sensor, sealed technology, applied in the field of sensors, can solve problems such as pressure leakage, and achieve the effect of avoiding pressure changes

Active Publication Date: 2019-03-12
合肥亿珀电子材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The structural shape of this temperature sensor can realize a sealed temperature sensor for ultra-high pressure vessels, where the movement of the temperature sensor wire can easily cause pressure leakage in the pressure vessel

Method used

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Embodiment Construction

[0023] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0024] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "upper", "lower" and "horizontal" are based on the orientation or positional relationship shown in the drawings, and are only for It is convenient to describe the utility and simplify ...

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Abstract

The invention relates to the technical field of sensors, in particular to a sealed temperature sensor. The sensor comprises a sensor body, wherein clamping blocks are arranged on the side walls of thesensor body and connected with sliding blocks through rotating rods; a first spring is arranged between every two rotating rods, an electric wire is connected above the sensor body, passes through asealing box and extends out of a mounting box, and a moving block is arranged in the sealing box and connected with one ends of sliding rods; the other ends of the sliding rods are connected with a sliding seat, and the sliding seat is connected with an arc-shaped plate outside the mounting box. According to the sealed temperature sensor, the four clamping blocks clamp the sensor body together toensure that the sensor body cannot fall off; by pulling the electric wire upwards to drive the moving block to move, the moving block can adjust the movement of the sliding rods; through the movementof the sliding rods, the arc-shaped plate can be adjusted to compress the electric wire; the arc-shaped plate can only move in a one direction, and therefore, the electric wire cannot be loosened after being locked. The pressure change in the mounting box caused by the random movement of the electric wire is avoided, and the poor contact between the electric wire and the sensor body caused by excessive extraction of the electric wire can be avoided by adopting buckles.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a sealed temperature sensor. Background technique [0002] A temperature transducer is a sensor that can sense temperature and convert it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument, and there are many varieties. According to the measurement method, it can be divided into two categories: contact type and non-contact type. According to the characteristics of sensor materials and electronic components, it can be divided into two types: thermal resistance and thermocouple. In recent years, the process of my country's industrial modernization and the continuous high-speed growth of the electronic information industry have driven the rapid rise of the sensor market. As an important category of sensors, temperature sensors account for more than 40% of the total sensor demand. The temperature sensor is a semiconductor d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K1/08G01K1/14G01K13/00
CPCG01K1/08G01K1/14G01K13/00
Inventor 朱林峰朱华松
Owner 合肥亿珀电子材料有限公司
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