Pressing device of integrated circuit board

Abstract

The invention discloses a pressing device of an integrated circuit board. The pressing device comprises a box body, a mounting rotating mechanism, a first hydraulic cylinder, a hydraulic oil tank, a slotted hole, an electric cabinet, a control panel, a PLC (Programmable Logic Controller), a supporting plate, a supporting bar, an upper die, a hot pressboard, a heat pipe, a temperature sensor, a groove, a heating resistor, a fan and a hydraulic pump; the slotted holes are symmetrically opened on both sides of the box body; the electric cabinet is mounted at one side of the box body; the controlpanel is mounted on one side of the electric cabinet; the PLC is mounted in the electric cabinet; and the mounting rotating mechanism is mounted at the top of the box body. The hydraulic oil tank is provided with a device for adjusting the temperature of the hydraulic oil, so that the temperature of the hydraulic oil is adjusted according to the actual situation to ensure the normal use of the hydraulic device; and at the same time, the mounting rotating mechanism improves the pressing efficiency of the whole pressing device and the pressing effect is good.

Description

technical field [0001] The invention relates to the field of integrated circuit board manufacturing equipment, in particular to an integrated circuit board pressing device. Background technique [0002] The integrated circuit board is a carrier for carrying integrated circuits, but it is often said that the integrated circuit board is also brought on the integrated circuit board. The integrated circuit board is mainly composed of silica gel, so it is generally green. The integrated circuit board adopts the semiconductor manufacturing process. Many transistors, resistors, capacitors and other components are fabricated on the smaller single crystal silicon wafer, and the components are combined into a complete electronic circuit according to the method of multi-layer wiring or tunnel wiring; A pre-fluxed tinned part is heated to a temperature high enough to melt and flow the solder. After curing, a permanent electrical and mechanical connection is formed between the part and t...

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Problems solved by technology

[0003] The existing integrated circuit board pressing device provides pressing force through the hydraulic device during use. When the hydraulic oil is used, if the temperature is too high, the viscosity of the hydraulic oil will be reduced, and the lubricity will be reduced, which will make the oil pump and hydraulic components The wear and tear is accelerated during work, which is easy to cause leakage. If the temperature is low, the viscosity of the hydraulic oil will increase, which will cause the movement flexibility of the hydraulic components to decrease. In severe cases, the moving components may not move and affect normal work; at the same time The overall pressing efficiency of the existing integrated circuit board pressing device is low, and the pressing effect is poor

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