Transportation equipment convenient for transferring silicon cutting slag

Abstract

The invention discloses transportation equipment convenient for transferring silicon cutting slag. The transportation equipment comprises a pedestal, a hydraulic cylinder and a sieving hopper, whereina sieving plate is arranged in the sieving hopper; a feed inlet and a feed outlet above the sieving plate are formed in the wall surface of the sieving hopper; a feeding plate is arranged in the feedinlet and a discharge plate is arranged in the feed outlet; a slag inlet and a slag outlet below the sieving plate are also formed in the wall surface of the sieving hopper; a slag inlet plate is arranged in the slag inlet and a filter tank is connected with the slag outlet through a slag inlet pipe; the filter tank comprises a shell, an exhaust tube above the slag inlet pipe is arranged on the shell, and a filter screen is arranged on the exhaust tube; a plurality of slag traps parallel to a horizontal plane are arranged in the shell from top to bottom; and a through hole is formed in each of the slag traps to communicate with the top of each of the slag traps and the bottom of each of the slag traps. According to the transportation equipment, silicon slags and silicon materials with different sizes can be classified and transported in batches, in addition, the silicon slags and the silicon materials can be further sieved in a transportation process, and the silicon slags detached from the silicon materials are fallen into a silicon slag placement cavity and are collected.

Description

technical field [0001] The invention relates to the field of silicon waste recycling, in particular to a transportation device for transferring silicon cutting slag. Background technique [0002] Polycrystalline silicon is made into a silicon wafer to be processed after ingot casting, ingot breaking, slicing and other procedures, and a small amount of boron and phosphorus are doped and diffused on the silicon wafer to form a P-N junction. Then use screen printing to print the finely prepared silver paste on the silicon wafer to make a grid line, and after sintering, make a back electrode at the same time, and coat a layer of anti-reflective coating on the surface with the grid line, and the battery sheet is This is done. [0003] During the cutting process of silicon wafers, more silicon slag will be produced, and recycling the silicon cutting slag can significantly reduce the production cost. Before the recovery process of silicon cutting slag, pretreatment processes such...

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Problems solved by technology

[0005] The purpose of the present invention is to provide a transportation device that facilitates the transfer of silicon cutting slag, so as to solve the problem that traditional hoppers cannot classify and transport silicon materials and silicon slag of different sizes, and that silicon materials and silicon slag cannot be further screened during transportation. To maximize the screening and recovery of silicon materials and silicon slag

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