High precision automatic polishing machine

Abstract

The invention discloses a high-precision automatic polishing machine, which includes a feeding support, a grinding support, a plurality of mechanical arms, a grinding head and a material delivery fixture. The grinding head and the delivery fixture are respectively installed and connected to the end nodes of the mechanical arm The feeding support and the grinding support are respectively arranged along the circumference of the mechanical arm, and the material delivery fixture is a suction cup mechanism, which includes a mounting plate and several suction cups connected to the mounting plate, and the grinding head includes an outer shell , an inner casing, a core and a rotating head, the inner casing is located in the outer casing, the core is rotatably arranged in the inner casing, the rotating head is installed and connected with the core, and has a The air pipe mounting seat on the air pipe installation seat includes an air inlet part and an air outlet part. The arrangement of the rubber ring, the sealing washer and the gasket of the present invention enhances the sealing effect under the grinding head layer by layer, which can effectively prevent water vapor and liquid from entering the inside of the casing, protect the components in the casing, and prolong its service life.

Description

technical field [0001] The invention relates to a high-precision automatic polishing machine, which belongs to the technical field of precision parts processing of electronic products. Background technique [0002] At present, most of the appearance structural parts / accessories of mobile phones and laptops on the market are made of metal materials. The forming of metal materials mainly includes aluminum extrusion, die-casting, forging and other methods. No matter which forming method is used, CNC machining centers are required for processing after forming. Due to the existence of poor appearance such as knife marks and scratches in the CNC machining process, a series of appearance retreatments such as passivation, grinding and polishing, spraying, and anodic oxidation must be carried out on the workpiece. However, on each workpiece, the area that needs to be polished is often only in a local area, because the grinding device cannot identify the local area that needs to be po...

AI Technical Summary

Problems solved by technology

However, on each workpiece, the area that needs to be polished is often only in a local area, because the grinding device cannot identify the local area that needs to be polished, and the local grinding can only be achieved through comprehensive grinding, which is time-consuming and labor-intensive, and the processing efficiency is low.

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