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Cyanide-free gold plating technology after nickel plating and priming of electronic component

A technology of cyanide-free gold plating for electronic components, which is applied in the technical field of cyanide-free gold plating of electronic components after nickel-plating as a primer, can solve the problems of difficult to meet the requirements of coating performance, poor gold-plating binding force, etc., to reduce the number of solution replenishment, Improved productivity and wide range of ratios

Active Publication Date: 2019-03-29
贵州振华群英电器有限公司(国营第八九一厂)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current process has the problem that the cyanide-free gold plating process has poor gold plating adhesion on the nickel layer, and the coating performance is difficult to meet the requirements.

Method used

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  • Cyanide-free gold plating technology after nickel plating and priming of electronic component
  • Cyanide-free gold plating technology after nickel plating and priming of electronic component
  • Cyanide-free gold plating technology after nickel plating and priming of electronic component

Examples

Experimental program
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Effect test

Embodiment 1

[0050] A cyanide-free gold-plating process for electronic components after nickel-plating and bottoming, comprising the following steps:

[0051] ① Take electronic components, soak them in 30% hydrochloric acid, rinse with tap water for 45s, clean, and chemically polish for 3min at room temperature. Soak in 12% sodium bicarbonate solution for 15s to neutralize, rinse with tap water for 45s, shake off excess water, soak in distilled alcohol for 12s, and dry at 100-110°C for 30min;

[0052] ②Clamp the electrical components treated in step ① to a conductive fixture, clean with tap water for 45s, and deoil by electrolysis. The deoiling by electrolysis is; 2 , temperature 60-80 ℃, forward time 2min, reverse time 1min, followed by 80-90 ℃ hot water cleaning for 45s, tap water for 3 times;

[0053] ③ Soak the electrical components treated in step ② with 18% analytical pure hydrochloric acid for 12s, move left and right up and down during soaking, and then clean with deionized water ...

Embodiment 2

[0061] A cyanide-free gold-plating process for electronic components after nickel-plating and bottoming, comprising the following steps:

[0062] ① Take electronic components, soak them in 30% hydrochloric acid, rinse them with tap water for 60s, clean them, and chemically polish them for 3min at room temperature. Soak in 15% sodium bicarbonate solution for 20s to neutralize, rinse with tap water for 60s, shake off excess water, soak in distilled alcohol for 15s, and dry at 100-110°C for 35min;

[0063] ②Clamp the electrical components treated in step ① to a conductive fixture, clean with tap water for 60s, and deoil by electrolysis. The deoiling by electrolysis is; 2 , temperature 60-80 ℃, forward time 2min, reverse time 1min, followed by 80-90 ℃ hot water cleaning for 60s, tap water for 5 times;

[0064] ③ Soak the electrical components treated in step ② with 20% analytical pure hydrochloric acid for 15s, move left and right up and down during soaking, and then clean with d...

Embodiment 3

[0072] A cyanide-free gold-plating process for electronic components after nickel-plating and bottoming, comprising the following steps:

[0073]① Take electronic components, soak them in 30% hydrochloric acid, rinse with tap water for 30s, clean, and chemically polish for 2min at room temperature. Soak in 10%% sodium bicarbonate solution for 10s to neutralize, rinse with tap water for 30s, shake off excess water, soak in distilled alcohol for 10s, and dry at 100-110℃ for 25min;

[0074] ②Clamp the electrical components treated in step ① to a conductive fixture, rinse with tap water for 30s, and deoil by electrolysis. The deoiling by electrolysis is; 2 , temperature 60-80 ℃, forward time 2min, reverse time 1min, followed by 80-90 ℃ hot water cleaning for 30s, tap water cleaning 2 times;

[0075] ③ Soak the electrical components treated in step ② with 15% analytical pure hydrochloric acid for 10s, move left and right up and down during soaking, and then clean with deionized wa...

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Abstract

The invention provides a cyanide-free gold plating technology after nickel plating and priming of an electronic component. The cyanide-free gold plating technology comprises the following steps of: taking the electronic component, soaking in hydrochloric acid, cleaning, carrying out chemical polishing, cleaning, neutralizing, clamping, cleaning and removing oil; activating, and cleaning with deionized water; carrying out impact nickel plating, wherein the impact nickel plating temperature is (10-30) DEG C, and the current density is (1-8) A / dm2; carrying out nickel electroplating, wherein thenickel electroplating temperature is (40-55) DEG C, and the current density is (0.1-1) A / dm2; recycling, cleaning with deionized water, and activating; carrying out gold plating (putting into a tank with electricity), wherein the gold plating temperature is (38-45) DEG C, and the current density is (0.1-0.3 ) A / dm2; recycling, cleaning with deionized water, unloading a clamp, dewatering, and drying; and carrying out heat treatment and after treatment. According to the technology, a gold-plating layer on a nickel-plating layer has good bonding force and good coating performance.

Description

technical field [0001] The invention relates to a process for cyanide-free gold-plating after nickel-plating primer for electronic components, and solves the problem of cyanide-free gold-plating bonding force after general nickel-plating primer. Background technique [0002] As the lead pins of high-reliability products of electronic components, it has always been cyanide-plated with silver as a primer, and then cyanide-plated with gold. With the continuous expansion of the requirements in the aerospace field, especially the continuous upgrading of the quality requirements of aerospace products, the coating requirements of the lead-out pins of high-reliability products are gradually referring to the American MIL standard, which must be nickel-plated and gold-plated. [0003] The adjustment of the national industrial policy, the full implementation of clean production, and the requirements of green ecological development, the research and development of cyanide-free electropl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/14C25D3/12C25D3/48
CPCC25D3/12C25D3/48C25D5/14
Inventor 王思醇刘春涛杨琼
Owner 贵州振华群英电器有限公司(国营第八九一厂)
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