The invention provides a process for cyanide-free gold plating of electronic components and parts after nickel-plating as a backing, which includes taking electronic components, soaking them in hydrochloric acid, cleaning, chemical polishing, cleaning, neutralization, clamping, cleaning, and degreasing; Activation, cleaning with deionized water; impact nickel plating, impact nickel plating temperature is (10~30)℃, current density is (1~8)A / dm 2 ; Nickel plating, nickel plating temperature is (40 ~ 55) ℃, current density is (0.1 ~ 1) A / dm 2 ; Recycling, cleaning with deionized water, activation; gold plating (charged lower tank), gold plating temperature is (38 ~ 45) ℃, current density is (0.1 ~ 0.3) A / dm 2 ; Recycling, cleaning with deionized water, unloading, dehydration, drying; heat treatment, post-processing, that is all. In the process of the invention, the gold-plated layer on the nickel-plated layer has good bonding force and good coating performance.