Silicon carbide chemical mechanical polishing liquid with improved pH value stability, and applications thereof

A chemical-mechanical and polishing liquid technology, applied in polishing compositions containing abrasives, electrical components, circuits, etc., can solve the problems of uncontrolled pH value, low abrasive hardness, low polishing efficiency of silicon carbide, etc. Agglomeration, dispersion stability, uniform dispersion, enhanced dispersion uniformity and stability

Active Publication Date: 2019-04-02
SICC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The CMP polishing liquid of ASAHI GLASS company uses potassium permanganate as the oxidizing agent and acidic silicon oxide or cerium oxide as the abrasive. During the use of the polishing

Method used

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  • Silicon carbide chemical mechanical polishing liquid with improved pH value stability, and applications thereof
  • Silicon carbide chemical mechanical polishing liquid with improved pH value stability, and applications thereof
  • Silicon carbide chemical mechanical polishing liquid with improved pH value stability, and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0059] Example 1:

[0060] A chemical mechanical polishing liquid for silicon carbide with stable pH, which comprises: 100ml of acidic alumina dispersion liquid with a concentration of 15%, 0.5% (based on the weight of alumina) surface modifier organic acid, 0.05% ( (Final concentration) pH stabilizer aluminum nitrate and 0.1% (final concentration) oxidant potassium permanganate.

Example Embodiment

[0061] Example 2:

[0062] A chemical mechanical polishing liquid for silicon carbide with stable pH, which comprises: 100ml of acidic alumina dispersion with a concentration of 25%, 2.0% (based on the weight of the alumina) surface modifier organic acid, 1.0% ( (Final concentration) pH stabilizer aluminum nitrate and 4.0% (final concentration) oxidant potassium permanganate.

Example Embodiment

[0063] Example 3:

[0064] A chemical mechanical polishing liquid for silicon carbide with stable pH. The polishing liquid comprises: 100ml of acidic alumina dispersion with a concentration of 20%, 1.0% (based on the weight of alumina) surface modifier organic acid, 0.08% ( (Final concentration) pH stabilizer aluminum nitrate and 2.5% (final concentration) oxidant potassium permanganate.

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Abstract

The invention provides a silicon carbide chemical mechanical polishing liquid with improved pH value stability, wherein the polishing liquid comprises an oxidizing agent, a high-hardness abrasive material and a pH value stabilizer, and the pH value stabilizer is aluminum nitrate. According to the present invention, the polishing liquid can well maintain the pH value stability during the chemical mechanical polishing, and has advantages of good dispersion stability and uniform dispersion; by adding the pH value stabilizer aluminum nitrate to the polishing liquid, the pH value stability of the polishing liquid during the chemical mechanical polishing is strong, and the polishing liquid is not easily subjected to hard agglomeration; and the polishing liquid is environmentally friendly, and can be used in a circulating material supply manner.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a silicon carbide chemical mechanical polishing liquid with stable pH value and application thereof. Background technique [0002] Due to the high hardness (9.5) and strong chemical inertness of silicon carbide, the polishing speed of alkaline hydrogen peroxide-silicon oxide CMP polishing fluid is very low (<50nm / hr), for two reasons: one is the hardness of silicon oxide Small (6-7); Second, the chemical action of the oxidizing agent is weak under alkaline conditions. Therefore, the use of α-Al whose hardness is second only to silicon carbide 2 o 3 The acidic (pH<7, especially pH<4) silicon carbide chemical mechanical polishing fluid of the abrasive has become the mainstream. [0003] In order to improve chemical oxidation, potassium permanganate has become the most widely used oxidant, but potassium permanganate will consume H during the oxidati...

Claims

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Application Information

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IPC IPC(8): C09G1/02H01L21/304
CPCC09G1/02H01L21/304
Inventor 窦文涛宗艳民梁庆瑞王含冠其他发明人请求不公开姓名
Owner SICC CO LTD
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