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Curable resin composition and structural material bonding adhesive agent using said composition

A curable resin and composition technology, applied in the direction of adhesives, adhesive types, epoxy glue, etc., can solve problems such as the adhesion of aluminum substrates that have not been paid attention to, and achieve the effect of improving adhesion

Active Publication Date: 2019-04-02
ADEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, adhesion to aluminum substrates is not of concern here

Method used

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  • Curable resin composition and structural material bonding adhesive agent using said composition

Examples

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Effect test

manufacture example 1

[0073] [Production Example 1: Production of Composition 1 Containing Phosphoric Acid-modified Epoxy Resin (A1) and Epoxy Resin (A2)]

[0074] "ADEKA resin EP-4100E" (bisphenol A type epoxy resin, cyclo Oxygen resin equivalent: 190 g / eq., manufactured by ADEKA CORPORATION) 890.6 g, and methyl ethyl ketone 142.4 g. The temperature of the obtained mixture was set at 40° C., and 11.1 g of an 85% by mass phosphoric acid aqueous solution was gradually added thereto as phosphoric acid (a1) while maintaining the temperature in the system at 60° C. or lower. After the addition was complete, the mixture was warmed to 70° C. and stirred for 30 minutes, completing the reaction of phosphoric acid and EP-4100E. After finishing the reaction, the temperature in the system was raised again, and methyl ethyl ketone and water in the system were removed under the conditions of 140° C. and 30 mmHg. At this time, the reaction product of phosphoric acid and EP-4100E and unreacted EP-4100E exist in...

manufacture example 2

[0076] [Production Example 2: Production of Composition 2 Containing Phosphoric Acid-modified Epoxy Resin (A1) and Epoxy Resin (A2)]

[0077] 1009.3 g of "ADEKA resin EP-4100E" as the epoxy compound (a2) and 151.4 g of methyl ethyl ketone were mixed in a 2L five-necked separable round bottom flask equipped with a serpentine condenser, a stirring blade, and a nitrogen tube. . The temperature of the obtained mixture was set to 40° C., and 12.6 g of an 85% by mass phosphoric acid aqueous solution was gradually added thereto as phosphoric acid (a1) while maintaining the temperature in the system at 60° C. or lower. After completion of addition, it heated to 70 degreeC and stirred for 30 minutes, and the reaction of phosphoric acid and "EP-4100E" was completed. After finishing the reaction, the temperature in the system was raised again, and methyl ethyl ketone and water in the system were removed under the conditions of 140° C. and 30 mmHg. At this time, the reaction product of ...

manufacture example 3

[0078] [Manufacture Example 3: Manufacture of Composition 3 Containing Phosphoric Acid-modified Epoxy Resin (A1) and Epoxy Resin (A2)]

[0079] 1003.4 g of "ADEKA resin EP-4100E" as epoxy compound (a2) and 181.3 g of methyl ethyl ketone were mixed in a 2L five-necked separable round bottom flask equipped with a serpentine condenser, a stirring blade, and a nitrogen tube. . The temperature of the obtained mixture was set at 40° C., and 18.3 g of an 85% by mass phosphoric acid aqueous solution was gradually added therein as phosphoric acid (a1) while maintaining the temperature in the system at 60° C. or lower. After completion of the addition, it was heated to 70° C. and stirred for 30 minutes to complete the reaction of phosphoric acid and EP-4100E. After finishing the reaction, the temperature in the system was raised again, and methyl ethyl ketone and water in the system were removed under the conditions of 140° C. and 30 mmHg.

[0080] At this time, the reaction product o...

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Abstract

The invention provides a curable resin composition that is suitable as a structural material bonding adhesive agent having a satisfactory adhesiveness particularly to aluminium. The curable resin composition contains: (A1) a phosphoric acid-modified epoxy resin (excluding a urethane-modified epoxy resin and a urethane-modified chelated epoxy resin) obtained by reacting phosphoric acids (a1) with an epoxy compound (a2); (A2) an epoxy resin (excluding the (A1) component); (B) a block urethane; and (C) a latent curing agent, wherein the phosphorus content in the total mass of the (A1) component and the (A2) component is 0.01-2.0 mass%.

Description

technical field [0001] The invention relates to a curable resin composition containing phosphoric acid modified epoxy resin, block polyurethane and latent curing agent. More specifically, the present invention relates to a curable resin composition suitable for use as an adhesive for joining structural materials, in which a cured product has excellent adhesion to aluminum materials in a wide temperature range from low to high temperatures. Background technique [0002] The application industry of structural material bonding technology involves many aspects such as the field of transportation equipment (automobiles, railway vehicles, aircraft, etc.), the field of energy (power generation equipment, etc.) and the field of infrastructure (bridges, buildings, etc.). In the automobile industry, materials centered on iron have been used for bodywork or engines until now, but CO 2 Due to the restriction of exhaust gas and the improvement of fuel consumption, materials that conside...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/20C08G18/58C08G18/80C08G59/14C09J11/06C09J163/00C09J163/02C09J175/04
CPCC08G18/58C08G18/80C08G59/14C08G59/20C09J11/06C09J175/04C09J163/00C08L63/00C08G59/1422C08G59/304C08G59/3272C08G59/4014C08G59/1488C08L75/04
Inventor 井手光纪太田啓介永松保
Owner ADEKA CORP
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