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Wafer processing method and device

A processing method and processing device technology, which is applied in the direction of grinding devices, grinding machine tools, metal processing equipment, etc., can solve the problems of high edge roughness, uneven grinding, and reduced equipment production capacity, so as to improve the quality of notch grinding and improve the protrusion The removal rate and the effect of reducing the rework rate

Inactive Publication Date: 2019-04-12
XIAN ESWIN SILICON WAFER TECH CO LTD
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Problems solved by technology

[0003] As far as the wafer edge polishing project is concerned, due to the mechanical characteristics of its grinding circular surface is not a flat surface, it is impossible to perform uniform grinding in all directions. Equipment production capacity has become the reason for increasing manufacturing costs
In addition, through the edge finishing process of felt pads, the edge roughness is relatively higher than that of the surface, so particles may be trapped in the edge area, which may cause adverse effects on subsequent cleaning processes

Method used

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  • Wafer processing method and device
  • Wafer processing method and device

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Embodiment Construction

[0042] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.

[0043] The wafer processing method according to the embodiment of the present invention will firstly be described in detail below.

[0044] Wafer processing method according to the embodiment of the present invention, comprises the following steps:

[0045] Step S1, polishing the kerf of the wafer;

[0046] Step S2, polishing the edge of the wafer;

[0047] Repeat step S1 and step S2 alt...

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Abstract

The invention provides a wafer processing method and device. The wafer processing method comprises the following steps that a notch of a wafer is polished; the edge of the wafer is polished; and the notch and the edge of the wafer are polished repeatedly and alternately till polishing of the edge of the wafer is finished. According to the wafer processing method, by repeatedly and alternately polishing the notch and the edge of the wafer and finishing the polishing of the edge of the wafer, the removal rate of protrusions nearby the notch corner is improved, the notch grinding quality is improved, the influence of particles falling on the edge area to the subsequent working procedure is reduced, the capacity is not reduced by processing the wafer through the method, the overall grinding amount of the edge face is increased so that the defects caused by not grinding of the edge can be reduced, the re-operation rate is reduced, and the wafer edge grinding effect is enhanced. The method can be achieved through the wafer processing device, and the wafer grinding quality is ensured.

Description

technical field [0001] The invention relates to the field of wafer technology, in particular to a wafer processing method and device. Background technique [0002] Edge polishing is applied in multiple stages of semiconductor engineering to prevent uneven coating caused by defects near the edge. The surface strength of the polished edge face is higher than that of the face state that is only ground, so it has the advantages of The purpose is to reduce the occurrence of cracks caused by external impact. [0003] As far as the wafer edge polishing project is concerned, due to the mechanical characteristics of its grinding circular surface is not a flat surface, it is impossible to perform uniform grinding in all directions. Equipment production capacity has become the reason for increasing manufacturing costs. In addition, through the edge finishing process of the felt pad, the edge roughness is relatively higher than that of the surface, so particles may be trapped in the e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00
Inventor 崔世勋具成旻李昀泽白宗权
Owner XIAN ESWIN SILICON WAFER TECH CO LTD
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