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HDI board fabrication method

A manufacturing method and substrate technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve the problems of unfavorable high-frequency board manufacturing, thick drilling holes, and large tolerance of incoming material thickness, so as to provide laser drill The effect of hole efficiency, shortening the plate making process, and uniform thickness of the medium

Inactive Publication Date: 2019-04-12
VICTORY GIANT TECH HUIZHOU CO LTD
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AI Technical Summary

Problems solved by technology

At the same time, this PP sheet pressing method is also affected by factors such as large tolerances in incoming material thickness, PP resin glue at the edge of the board will flow out of the board during pressing, uneven pressing glue flow, and uneven pressing of the pressed steel plate. The dielectric thickness is uneven, and the glass cloth fiber is thick to the drilling hole, laser opening, CAF and dielectric properties are also affected, which is not conducive to the production of high-frequency boards

Method used

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Embodiment Construction

[0018] In order to facilitate those skilled in the art to better understand the present invention, it will be described in detail below.

[0019] The basic steps of the HDI board manufacturing method of the present invention are:

[0020] a. Substrate cutting and inner layer circuit making;

[0021] b. Substrate double-sided screen printing resin;

[0022] c. drilling;

[0023] d. Immersion copper, electroplating.

[0024] Taking a four-layer board as an example, firstly, the inner layer, namely the L2 / L3 layer substrate, needs to be cut out to make the inner layer circuit. After the circuit is manufactured, the board needs to be tested by AOI to ensure the printing quality of the inner layer board circuit.

[0025] The above steps are the same as the existing technology. In the existing technology, after the inner layer circuit is tested and passed, the surface of the board needs to be browned, and PP sheets are used for lamination, as well as target shooting, edge mil...

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Abstract

The invention relates to an HDI board fabrication method. The method comprises the steps of substrate cutting, inner-layer circuit, inner-layer AOI, resin silk-screen, resin grinding, shooting, laserdrilling, mechanical drilling, copper deposition, electroplating and post process. In the circuit board fabricated by the method, the dielectric thickness requirements of different clients can be met,and the dielectric thickness can be flexibly adjusted and is uniform; meanwhile, the method is short in fabrication process and high in efficiency, and the cost is greatly reduced compared with a traditional lamination process; better dielectric performance can be obtained, the impedance characteristic of the circuit board particularly an HDI board is improved, so that the circuit board has favorable signal transmission performance, and the high-frequency and high-speed requirement of the client is met.

Description

technical field [0001] The invention relates to a circuit board production technology, in particular to a method for manufacturing an HDI board. Background technique [0002] With the rapid development of industries such as artificial intelligence, unmanned driving, the Internet of Things and electronic communications, various electronic products have higher and higher requirements for the accuracy of circuit boards. [0003] The dielectric thickness and material of the circuit board are the most critical factors affecting impedance and signal loss. Conventional production of multi-layer boards or HDI boards requires the use of laminated PP sheets to control the thickness of the medium. However, PP sheets generally contain support materials such as glass cloth fibers, and the thickness is fixed, such as 1080 series thickness of 3.0mil, 3.2mil, 3.5mil, etc. At the same time, this PP sheet pressing method is also affected by factors such as large tolerances in incoming mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/00
CPCH05K3/0026H05K3/0047H05K3/4644
Inventor 张永谋张亚锋何艳球叶锦群蒋华张宏
Owner VICTORY GIANT TECH HUIZHOU CO LTD
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