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Copper-based ultra-thin heat pipe with super-hydrophobic-super-hydrophilic structure and preparation method

An ultra-thin heat pipe and super-hydrophilic technology, applied in lighting and heating equipment, indirect heat exchangers, etc., can solve the problems of low miniaturization, complicated process, and high cost, and achieve improved heat dissipation efficiency, simple process, and low cost Effect

Inactive Publication Date: 2019-04-16
HUBEI UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem mainly solved by the present invention is to provide a copper-based ultra-thin heat pipe with superhydrophobic-superhydrophilic structure and its preparation method, which are used to solve the problem of poor heat dissipation, low degree of miniaturization, complex process, high cost issues

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  • Copper-based ultra-thin heat pipe with super-hydrophobic-super-hydrophilic structure and preparation method
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  • Copper-based ultra-thin heat pipe with super-hydrophobic-super-hydrophilic structure and preparation method

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[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] For the first solution provided by this invention, see figure 1 and figure 2 , figure 1 It is a schematic flow chart of an embodiment of a method for preparing a copper-based ultra-thin heat pipe with a superhydrophobic-superhydrophilic structure in the present invention, figure 2 It is a device schematic diagram of an embodiment of the method for preparing a copper-based ultra-thin heat pipe with a superhydrophobic-superhydrophilic structure in the...

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Abstract

The invention discloses a copper-based ultra-thin heat pipe with a super-hydrophobic-super-hydrophilic structure and a preparation method. The preparation method includes the steps that a copper baseplate is milled to form a groove face and is cleaned thoroughly; a first area of the groove face is subjected to face scanning through a nanosecond laser processing device, a continuous capillary structure with a fuzzy morphology is formed, and a super-hydrophobic area is obtained after heat treatment; after the copper base plate is cooled, a second area of the groove face is subjected to face scanning through the nanosecond laser processing device, a continuous capillary structure with a fuzzy morphology is formed, and a super-hydrophilic area is obtained; two copper bases in the same size and with continuous capillary structures are welded together in a manner that the groove faces are opposite; and after work media are injected into a cavity formed by the two groove faces, sealing treatment is performed. According to the copper-based ultra-thin heat pipe with the super-hydrophobic-super-hydrophilic structure and the preparation method, due to laser surface modification, and the manner that the super-hydrophobic areas and the super-hydrophilic areas of the continuous capillary structures are alternately distributed on the inner wall, the heat dissipating efficiency is substantially improved, and the heat pipe is lighter and thinner.

Description

technical field [0001] The invention relates to the field of heat conductors, in particular to a copper-based ultra-thin heat pipe with a superhydrophobic-superhydrophilic structure and a preparation method thereof. Background technique [0002] In recent years, the demand for notebook computers has been growing continuously. The heat dissipation problem has always been a technical bottleneck that plagues the performance improvement of notebook computers. This poses a severe challenge to the cooling system of notebook computers. With the development, the problem of heat dissipation has become increasingly prominent. [0003] At present, the heat dissipation system of portable products is mainly based on heat pipes, which mainly use the phase change of liquid to achieve the purpose of heat dissipation. Traditional heat pipes include sealed vacuum tubes, liquid-absorbing cores, and working media. The key technology is to improve the capillary force of liquid-absorbing cores. ...

Claims

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Application Information

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IPC IPC(8): F28D15/04
CPCF28D15/046
Inventor 娄德元杨少坤刘庆梅胜杨奇彪刘顿陶青成健
Owner HUBEI UNIV OF TECH
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