A parallel pipeline liquid cooling radiator for high power igbt heat dissipation

Abstract

The invention relates to a parallel pipe liquid-cooling radiator used for the heat radiation of a high-power IGBT, and relates to the technical field of power electronics. The radiator comprises two aluminum plates and a composite copper pipe. The composite copper pipe is embedded between the two overlapped aluminum plates, and the aluminum plates are provided with grooves corresponding to the composite copper pipe. The composite copper pipe comprises a plurality of U-shaped loops connected in parallel, and a liquid inlet pipe and a liquid outlet pipe which are parallel to each other. One endof the liquid inlet pipe is communicated with one end of the liquid outlet pipe, and the other end of the liquid inlet pipe serves as a liquid inlet, and the other end of the liquid outlet pipe servesas a liquid outlet. One end of each U-shaped loop is communicated with the liquid inlet pipe, and the other end of each U-shaped loop is communicated with the liquid outlet pipe. The radiator is moreconvenient to install and maintain, the heat exchange balance performance of the radiator is improved, and meanwhile. the safety and reliability of the liquid cooling radiator are improved.

Description

Technical field [0001] The invention relates to the technical field of power electronics, in particular to a parallel pipeline liquid cooling radiator used for heat dissipation of high-power IGBTs. Background technique [0002] The heat generated during the operation of IGBT (Insulated Gate Bipolar Transistor) devices will increase the internal chip temperature. If the IGBT heat dissipation problem is not handled properly, the chip temperature may rise above the maximum allowable IGBT junction temperature, which leads to deterioration or failure of device performance; especially for IGBT devices in ultra-high-power high-voltage frequency conversion, SVG and photovoltaic inverter products, their current ratings are more than 600A, and the heat generation is very large during operation, which is harmful to heat dissipation. The requirements are very high. In this case, liquid-cooled radiators are more commonly used in the market, but liquid-cooled radiators have the following defe...

AI Technical Summary

Problems solved by technology

When the aluminum plate is penetrated by the screw and fixes the IGBT device, the refrigerant liquid will flow out to the IGBT device along the screw, causing damage to the device

[0005] 3. The liquid cooling circuit is a separate flow tank circuit connected in series, the heat transfer efficiency of the front and rear positions of the circuit is extremely unbalanced, and the heat transfer effect of the IGBT device at the end of the circuit is poor

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