Boron nitride/epoxy resin composite and preparation method and application thereof

A technology of epoxy resin and composite materials, which is applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems of inability to form thermal conduction paths, and the thermal conductivity of thermal interface materials is not very obvious, so as to achieve easy operation and environmental friendliness , low-cost effect
CN109666263AActive Publication Date: 2019-04-23ZHEJIANG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ZHEJIANG UNIV
Publication Date
2019-04-23

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Abstract

The invention relates to boron nitride / epoxy resin composite and a preparation method and application thereof. The preparation method includes: 1) dispersing boron nitride nanosheet and a binder in water to form a mixed solution; 2) subjecting the mixed solution to bidirectional freezing, and removing ice crystal by lyophilization to obtain boron nitride aerogel with lamellar oriented structure; 3) filling the lamellar oriented structure of the boron nitride aerogel with cured epoxy resin to obtain the boron nitride / epoxy resin composite. The preparation method is simple to perform, is available to large-scale preparation and is suitable for industrial scaled application.
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Description

technical field

[0001] The invention relates to the field of preparation of thermal interface materials, in particular to a preparation method, product and application of a boron nitride / epoxy resin composite material. Background technique

[0002] With the rapid increase in the integration level and assembly density of electronic devices, excessive heat generated during the operation of electronic devices will have a harmful impact on the stability, reliability and life of the device. For example, excessive temperature will endanger the junction of semiconductors. , damage the connection interface of the circuit, increase the resistance of the conductor and cause mechanical stress damage, so heat dissipation has become one of the core issues in the entire field of electronic devices and packaging.

[0003] Thermal interface material is a general term for materials used to reduce the contact thermal resistance between heat dissipation devices and heat generating devices. Al...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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