Boron nitride/epoxy resin composite and preparation method and application thereof

A technology of epoxy resin and composite materials, which is applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems of inability to form thermal conduction paths, and the thermal conductivity of thermal interface materials is not very obvious, so as to achieve easy operation and environmental friendliness , low-cost effect

Active Publication Date: 2019-04-23
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the traditional method of adding boron nitride as a thermal conductive filler to polymer-based thermal interface materials cannot form an efficient thermal conduction path, resulting in an insignificant improvement in the thermal conductivity of the final thermal interface material.

Method used

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  • Boron nitride/epoxy resin composite and preparation method and application thereof
  • Boron nitride/epoxy resin composite and preparation method and application thereof
  • Boron nitride/epoxy resin composite and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] (1) Solution preparation: Take 6.87g of boron nitride powder and disperse in 200mL of isopropanol and deionized water (volume ratio 1:1) mixed solution at room temperature, ball mill for more than 12h to make it evenly dispersed, ultrasonic for 1h, 2000r / min Centrifuge for 5 minutes, take the supernatant and centrifuge at 9000 r / min for another 5 minutes, remove the supernatant, and freeze-dry the solid at the bottom to obtain boron nitride nanosheets.

[0060] Take 0.27g of polyvinyl alcohol and 17mL of deionized water, heat at 90°C for 30 minutes to completely dissolve the polyvinyl alcohol in deionized water, add 6.87g of boron nitride nanosheets, stir evenly, ultrasonicate for 1 hour, and vacuum remove air bubbles to obtain a relatively stable mixture solution, wherein the volume fraction of boron nitride nanosheets is 15 vol%, and the volume fraction of polyvinyl alcohol is 2 vol%.

[0061] (2) Two-way freezing: the mixed solution obtained in step (1) is placed in ...

Embodiment 2

[0065] (1) Solution preparation: Take 6.87g of boron nitride powder and disperse in 200mL of isopropanol and deionized water (volume ratio 1:1) mixed solution at room temperature, ball mill for more than 12h to make it evenly dispersed, ultrasonic for 1h, 2000r / min Centrifuge for 5 minutes, take the supernatant and centrifuge at 9000 r / min for another 5 minutes, remove the supernatant, and freeze-dry the solid at the bottom to obtain boron nitride nanosheets.

[0066] Take 0.27g of polyvinyl alcohol and 17mL of deionized water, heat at 90°C for 30 minutes to completely dissolve the polyvinyl alcohol in deionized water, add 6.87g of boron nitride nanosheets, stir evenly, ultrasonicate for 1 hour, and vacuum remove air bubbles to obtain a relatively stable mixture solution, wherein the volume fraction of boron nitride nanosheets is 15 vol%, and the volume fraction of polyvinyl alcohol is 2 vol%.

[0067] (2) Two-way freezing: the mixed solution obtained in step (1) is placed in ...

Embodiment 3

[0071] (1) Solution preparation: Take 6.87g of boron nitride powder and disperse in 200mL of isopropanol and deionized water (volume ratio 1:1) mixed solution at room temperature, ball mill for more than 12h to make it evenly dispersed, ultrasonic for 1h, 2000r / min Centrifuge for 5 minutes, take the supernatant and centrifuge at 9000 r / min for another 5 minutes, remove the supernatant, and freeze-dry the solid at the bottom to obtain boron nitride nanosheets.

[0072] Take 0.27g of polyvinyl alcohol and 17mL of deionized water, heat at 90°C for 30 minutes to completely dissolve the polyvinyl alcohol in deionized water, add 6.87g of boron nitride nanosheets, stir evenly, ultrasonicate for 1 hour, and vacuum remove air bubbles to obtain a relatively stable mixture solution, wherein the volume fraction of boron nitride nanosheets is 15 vol%, and the volume fraction of polyvinyl alcohol is 2 vol%.

[0073] (2) Two-way freezing: the mixed solution obtained in step (1) is placed in ...

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Abstract

The invention relates to boron nitride/epoxy resin composite and a preparation method and application thereof. The preparation method includes: 1) dispersing boron nitride nanosheet and a binder in water to form a mixed solution; 2) subjecting the mixed solution to bidirectional freezing, and removing ice crystal by lyophilization to obtain boron nitride aerogel with lamellar oriented structure; 3) filling the lamellar oriented structure of the boron nitride aerogel with cured epoxy resin to obtain the boron nitride/epoxy resin composite. The preparation method is simple to perform, is available to large-scale preparation and is suitable for industrial scaled application.

Description

technical field [0001] The invention relates to the field of preparation of thermal interface materials, in particular to a preparation method, product and application of a boron nitride / epoxy resin composite material. Background technique [0002] With the rapid increase in the integration level and assembly density of electronic devices, excessive heat generated during the operation of electronic devices will have a harmful impact on the stability, reliability and life of the device. For example, excessive temperature will endanger the junction of semiconductors. , damage the connection interface of the circuit, increase the resistance of the conductor and cause mechanical stress damage, so heat dissipation has become one of the core issues in the entire field of electronic devices and packaging. [0003] Thermal interface material is a general term for materials used to reduce the contact thermal resistance between heat dissipation devices and heat generating devices. Al...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L29/04C08K7/00C08K3/38C08K7/24C08K9/00C09K5/14
CPCC08K2003/385C08K2201/011C08L63/00C09K5/14C08L29/04C08K7/00C08K3/38C08K7/24C08K9/00
Inventor 柏浩韩敬恺杜高来高微微
Owner ZHEJIANG UNIV
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