Butterfly semiconductor laser device automatic coupling sealing optical fiber fixture

Abstract

The invention discloses a butterfly semiconductor laser device automatic coupling sealing optical fiber fixture, and relates to the field of electronic component automatic coupling sealing. The optical filer fixture comprises an optical fiber fixture position adjusting device and fixture module, the fixture module is installed on the optical fiber fixture position adjusting device through an L-shaped switching plate, the fixture module comprises components of a fixture installing supporting frame, a fixture positioning seat, an angle adjusting mechanism, an optical fiber tail end fixture, an optical fiber metal sleeve tube end fixture which is suspended in front of the optical fiber tail end fixture and the like, and slit optical fiber placing holes which basically parallel to the longitudinal extending direction of the optical fiber tail end fixture are formed in the fixture installing supporting frame and the angular adjusting mechanism. The optical fiber fixture has the advantages that optical fibers can be conveniently placed and taken out, coarse tuning and fine tuning can be conveniently conducted to facilitate the alignment of optical fibers, the coupling efficiency can be greatly improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of automatic coupling packaging, in particular to an optical fiber clamp for automatic coupling packaging of butterfly semiconductor lasers. Background technique [0002] With the development of optical fiber communication and optical fiber sensing technology, the preparation of optoelectronic devices has become the key to the progress of optical information technology. In optical communication products, the demand for optoelectronic devices such as butterfly semiconductor lasers is increasing with the development. Butterfly semiconductor lasers are the most commonly used long-distance transmission optical signal amplification devices in the optical fiber communication industry, but the packaging cost of butterfly semiconductor lasers has always been high. The huge contradiction has greatly limited the development speed of the optoelectronic device industry. [0003] The biggest bottleneck in the optoelect...

AI Technical Summary

Problems solved by technology

However, these complete sets of equipment are expensive and require high capital investment, and the packaging process used by these packaging equipment also has many places to be improved, such as insufficient precision of fiber coupling, etc.

Therefore, how to solve the problems of low fiber coupling accuracy, high packaging cost, and low product qualification rate in the existing technology is the top priority in the development of butterfly semiconductor lasers.

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