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Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module

A technology of resin composition and sealing material, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, adhesive additives, etc., can solve the problems of poor moisture resistance of resin compositions, and achieve the effect of high reliability and excellent pot life

Active Publication Date: 2019-05-03
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional thiol-based curing agents (such as pentaerythritol tetrakis(3-mercaptopropionate) manufactured by SC Organic Chemicals (trade name: PEMP), trimethylolpropane tris(3-mercaptopropionate) manufactured by SC Organic Chemicals, etc. (trade name: TMMP) and Pentaerythritol tetrakis(3-mercaptobutyrate) manufactured by Showa Denko (trade name: KarenzMT PE1)) have the problem that the cured resin composition has poor moisture resistance

Method used

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  • Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module
  • Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module
  • Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module

Examples

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Embodiment

[0085] Hereinafter, this embodiment will be described using examples. However, this embodiment is not limited by these Examples. In addition, in the following examples, parts and % represent parts by mass and % by mass unless otherwise specified.

[0086] According to the formulations shown in Tables 1 and 2, the resin composition was prepared using a three-roll mill. In Tables 1 to 2, the aforementioned (b2) is exemplified as the (B') component. In addition, as (B") and (B'') components, the aforementioned (b1) is exemplified. Moreover, when (C) contains an epoxy resin, the epoxy functional group equivalent contained in (C) is calculated|required, and a functional group equivalent ratio is computed.

[0087] 〔Viscosity〕

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PUM

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Abstract

Provided is a resin composition which is able to be cured fast at low temperatures, while having high bonding strength (especially, high peel strength) after curing, and which is capable of suppressing decrease in the bonding strength (especially, in the peel strength) after a moisture resistance test of the resin composition after curing, while having excellent pot life. The present invention provides a resin composition which contains (A) an epoxy resin, (B) a thiol compound represented by C(CH2OR1)(CH2OR2)(CH2OR3)(CH2OR4) (wherein each of R1, R2, R3 and R4 independently represents a hydrogen atom or CnH2nSH (wherein n represents a number of 2-6); and at least one of R1, R2, R3 and R4 represents CnH2nSH (wherein n represents a number of 2-6), (b) a thiol compound other than the component(b), and (C) a latent curing accelerator.

Description

technical field [0001] The present invention relates to a resin composition capable of rapid curing at low temperature and the like. Background technique [0002] A resin composition capable of rapid curing at low temperature and excellent in moisture resistance after curing is known. Currently, in order to maintain reliability and the like, electronic components such as semiconductor chips included in semiconductor devices are used after being bonded and sealed with a resin composition. In this semiconductor device, especially when the manufacturing process of an image sensor module becomes high temperature, the lens etc. used for an image sensor module will deteriorate. Therefore, low-temperature curability is required for adhesives and sealing materials used in the manufacture of image sensor modules for use in image sensor modules. In addition, short-time curability is also required from the viewpoint of production cost. Furthermore, it is also required to make the re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/66C09J11/06C09J163/00C09K3/10H01L23/29H01L23/31
CPCC08G59/66C09J11/06C09J163/00C09K3/10H01L27/14618C08G75/12H01L27/146H01L23/295H01L23/31C08K5/0025C08K5/3445C08K5/5419C08L63/00C08L2203/206C08L2312/00H01L23/29C08G59/68B32B27/26B32B27/38
Inventor 岩谷一希新井史纪
Owner NAMICS CORPORATION
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