A workbench for bonding gold wire processing

Abstract

The invention discloses a worktable for processing a gold bonding wire. The worktable comprises a top plate, a working plate, a mounting member, a support frame, a door panel, universal wheels, a ventilation window, a controller, a power interface, an efficient cleaning device and an auxiliary processing device. The efficient cleaning device is arranged to assist in quick cleaning and treatment ofexhaust gas, residual materials and residual dust can be quickly processed in a concentrated manner after use, the cleaning speed is fast, convenience and quickness are achieved, residues are less, the effect is good, and efficient exhaust of the exhaust gas can be achieved; and in addition, layer by layer purification treatment can be achieved, toxic substances are absorbed to be finally discharged, purification of the exhaust gas is achieved, the impact of the exhaust gas on the human body and the environment is reduced, the auxiliary processing device can fix auxiliary mobile devices and handheld mobile devices, data are displayed to assist a user in processing, the convenience is high, some auxiliary positioning lights can be fixed for positioning, the auxiliary performance is strong,and the convenient performance is good.

Description

technical field [0001] The invention relates to the related field of bonding gold wire processing, in particular to a workbench for bonding gold wire processing. Background technique [0002] Bonding gold wire is a gold alloy wire used as a connecting wire in integrated circuits, also known as ball bonding gold wire or lead gold wire. The gold content is ≥99.99%, and the sum of trace elements is <0.01%. There are γ-type, C-type and FA type and other three types, the latter two are used for high-speed bonding, and the trace elements are beryllium, copper, silver, etc., which have the functions of refining grains, increasing recrystallization temperature and strengthening gold. Melting and directional crystallization, the cast ingot is cold-processed after homogenization, or manufactured by liquid extrusion process, bonding gold wire is an important material in the microelectronics industry, used as a connecting wire between chip and lead frame, and is processed in bonding ...

AI Technical Summary

Problems solved by technology

[0002] Bonding gold wire is a gold alloy wire used as a connecting wire in integrated circuits, also known as ball bonding gold wire or lead gold wire. The gold content is ≥99.99%, and the sum of trace elements is <0.01%. There are γ-type, C-type and FA type and other three types, the latter two are used for high-speed bonding, and the trace elements are beryllium, copper, silver, etc., which have the functions of refining grains, increasing recrystallization temperature and strengthening gold. Melting and directional crystallization, the cast ingot is cold-processed after homogenization, or manufactured by liquid extrusion process, bonding gold wire is an important material in the microelectronics industry, used as a connecting wire between chip and lead frame, and is processed in bonding gold wire The process needs to use cutting, polishing and other treatments. In the process of processing, it is necessary to use the workbench to provide assistance for the processing, so that the processing effect and efficiency are higher. For example, a special cutting machine is required in the cutting process. Using a workbench, the existing workbench for bonding gold wire cutting is inconvenient and difficult to clean and collect the remaining material and dust remaining on the workbench after cutting; it is easy to generate waste gas during processing, and it is easy to cause physical damage to the processor when working. Discomfort, poor exhaust gas treatment performance; when performing precise processing or specified data processing, it is not convenient to install an external auxiliary processing device to achieve fast and precise processing

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