Defect monitoring and analysis system and method
A defect monitoring and analysis system technology, applied in electrical components, circuits, semiconductor/solid-state device manufacturing, etc., to achieve the effect of improving product yield and reducing the probability of defects occurring
Active Publication Date: 2021-08-13
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology
[0005] The technical problem to be solved by the present invention is to provide a defect monitoring and analysis system, which can timely discover the changes of relevant parameters and possible defect effects
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[0019] A defect monitoring and analysis system according to the present invention, such as figure 1 As shown, there are two modules: module 1: known component failure problem analysis system, and module 2: baseline upward trend problem analysis system.
[0020] Module 1: Known device failure problem analysis system, including process problems and equipment problems, correlates defects found in process problems with machine parameters, establishes internal connections, and forms a database.
[0021] The process problem mentioned refers to the problem of product defects caused by defects in the process, or unreasonable settings of the process and parameters in the product manufacturing process. Stability, raw material supply parameters are not up to standard, or product defects caused by structural problems of the equipment itself.
[0022] Module 2: Baseline upward trend problem analysis system, by comparing the baseline upward trend curve with the machine action time point, f...
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The invention discloses a defect monitoring and analysis system, which includes two modules: Module 1: an analysis system for known device failure problems, the known device failure problem analysis system includes process problems and equipment problems, and the problems in the process problems The found defects are associated with the machine parameters to establish an internal connection and form a database; module 2: the baseline upward trend problem analysis system, by comparing the baseline upward trend curve with the machine action time point, find out the cause of the defect. The defect monitoring and analysis system of the present invention integrates relevant process parameters, establishes a corresponding relationship between defects and machines and machine-related parameters by establishing a defect monitoring and analysis system, and designs a scientific and effective monitoring method, which can discover relevant parameters in time Changes and the impact of possible defects can effectively reduce the probability of defects and improve product yield.
Description
technical field [0001] The invention relates to the field of semiconductor device manufacturing technology, in particular to a defect monitoring and analysis method. Background technique [0002] As the size of semiconductor manufacturing technology continues to shrink, the manufacturing process is becoming more and more complex. The manufacturing and packaging of wafers is a rather long and complicated process involving hundreds of steps. These steps cannot be performed perfectly every time, pollution And material variations will be incorporated into the process causing wafer defect losses. Maintaining and improving process and product yield is critical to the semiconductor industry. In the wafer manufacturing process, defects have become the key to restricting the improvement of yield. There are many kinds of wafer defects, such as short circuit, open circuit, impurity contamination and so on. Typically, fabs will monitor at three major points in the process, when the w...
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IPC IPC(8): H01L21/67
Inventor 汪金凤
Owner SHANGHAI HUALI MICROELECTRONICS CORP