Double-head type efficient grinding mechanism for semiconductor crystal bar

Abstract

The invention discloses a double-head type efficient grinding mechanism for a semiconductor crystal bar. The mechanism comprises two grinding feeding assemblies which are structured the same, whereinthe two grinding feeding assemblies are oppositely arranged in the same plane and are not symmetric to each other; each grinding feeding assembly comprises a vertical moving assembly, a main shaft rotating assembly and a transverse feeding assembly; each main shaft rotating assembly comprises a main shaft rotating motor, a transmission shaft, a bearing box and an adapting plate; one end of each transmission shaft is connected to the output end of the corresponding main shaft rotating motor through a coupling, and the other end of each transmission shaft is connected to the corresponding adapting plate; a grinding wheel is mounted on each adapting plate; the main shaft rotating assemblies are mounted on the vertical moving assemblies in an up-down sliding manner; and the vertical moving assemblies can be mounted on the transverse feeding assemblies in opposite directions of the two grinding feeding assemblies by a reciprocating sliding manner. According to the grinding mechanism, the grinding wheels can be controlled to horizontally and vertically upwards move so as to realize rolling grinding and OF surface grinding of crystal bars with different diameter.

Description

technical field [0001] The invention relates to the technical field of processing semiconductor crystal rods, in particular to a high-efficiency grinding mechanism with double grinding heads for semiconductor crystal rods. Background technique [0002] Before slicing semiconductor ingots, the ingots need to be rounded and OF surface ground (or V-groove ground), and the grinding accuracy tolerance is required to be below 0.04mm. The grinding position of the grinding wheel used in the spherical grinding and OF surface grinding of the semiconductor ingot is different. The upper edge of the grinding wheel is used for the spherical grinding of the ingot, and the center position of the grinding wheel is used for the OF surface grinding of the ingot. It is required that the grinding wheel can realize the motion control of two extreme positions in the vertical direction; when grinding crystal rods of different diameters, it is required that the grinding wheel can realize front and r...

AI Technical Summary

Problems solved by technology

At present, the grinding head layout of the existing grinding equipment in the industry has low grinding efficiency and cannot maximize the use value of the equipment. At the same time, the grinding lateral and vertical feed accuracy is low, which cannot meet the high precision requirements of grinding, and the cost is expensive.

Images