A method for automatic coupling and packaging of butterfly semiconductor lasers

Abstract

The invention discloses an automatic coupling package method of a butterfly-shaped semiconductor laser, and relates to the field of automatic coupling package of electronic devices. The automatic coupling package method comprises the steps of feeding-onto-machine of accessories, coupling alignment, welding and the like. An automatic coupling package device realizing the automatic coupling packagemethod comprises vertical columns, a transverse beam, an optical fiber clamp, a lens clamp mechanism, a lower clamp device, a material disc mechanism, a laser power meter and the like, wherein the optical fiber clamp, the lens clamp mechanism, the lower clamp device, the material disc mechanism and the laser power meter are arranged on a base; and the positions of the optical fiber clamp, the lensclamp mechanism and an optical fiber automatic angle-adjusting welding device can be adjusted so as to realize accurate coupling package of the butterfly-shaped semiconductor laser. The automatic coupling package method is high in automation degree and high in package efficiency; the coupling package device adopted by the automatic coupling package method is reasonable in structural design, the complete subsequent procedures from coupling alignment to package can be automatically completed, and compared with a traditional manual production line, the automatic coupling package device has the advantages of being easy and convenient to operate, low in production cost, stable in product quality and the like.

Description

technical field [0001] The invention relates to the technical field of automatic coupling packaging, in particular to an automatic coupling packaging method for a butterfly semiconductor laser. Background technique [0002] With the development of optical fiber communication and optical fiber sensing technology, the preparation of optoelectronic devices has become the key to the progress of optical information technology. In optical communication products, the demand for optoelectronic devices such as butterfly semiconductor lasers is increasing with the development. Butterfly semiconductor lasers are the most commonly used long-distance transmission optical signal amplification devices in the optical fiber communication industry, but the packaging cost of butterfly semiconductor lasers has always been high. The huge contradiction has greatly limited the development speed of the optoelectronic device industry. [0003] The biggest bottleneck in the optoelectronic device pa...

AI Technical Summary

Problems solved by technology

However, these complete sets of equipment are expensive and require high capital investment, and the packaging process used by these packaging equipment also has many places to be improved, such as insufficient precision of fiber coupling, etc.

Therefore, how to solve the problems of low fiber coupling accuracy, high packaging cost, and low product qualification rate in the existing technology is the top priority in the development of butterfly semiconductor lasers.

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