Addition type silica gel for remaking refined decorative pattern mold, preparation method and application thereof

A technology of addition molding and mold, which is applied in the field of preparation of addition molding silica gel, can solve the problems of poor wettability of two-component addition molding silica gel, inability of epoxy resin to flow completely, and low emulation rate of epoxy mold patterns, etc., and achieves improvement Good polarity, dimensional stability, and small linear shrinkage

Inactive Publication Date: 2019-05-21
JILIN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the epoxy resin cannot completely flow into the micron level of the silicone negative film due to the poor wettability of the epoxy resin and the two-component addition type silica gel for making the silicone negative mold during the production process of the epoxy mold. In the groove, the problem of low emulation rate of the epoxy mold pattern is caused, and an addition-type silica gel for reproducing fine pattern molds is provided.

Method used

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  • Addition type silica gel for remaking refined decorative pattern mold, preparation method and application thereof
  • Addition type silica gel for remaking refined decorative pattern mold, preparation method and application thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0026] Preparation of component A: 25 parts of vinyl silicone oil, 25 parts of hydrogen silicone oil and 0.2 parts of polyether polymer surfactant;

[0027] Preparation of component B: 25 parts of vinyl silicone oil, 1 part of platinum catalyst, 0.3 part of inhibitor and 0.1 part of polyether polymer surfactant;

[0028] At 20-30°C, mix 10 parts of vinyl MQ silicone resin and 5 parts of fumed silica into components A and B, then mix evenly according to the mass ratio of 1:1, then vacuumize and defoam for 5 minutes. After the operation is completed, cure at 20-30°C for 3 hours. After the silicone is completely cured, pour epoxy resin into the silicone female mold. After the epoxy resin is completely cured, remove the mold and measure the depth of the pattern on the surface of the epoxy resin.

Embodiment 2

[0030] Preparation of component A: 30 parts of vinyl silicone oil, 30 parts of hydrogen silicone oil and 1 part of polyether polymer surfactant;

[0031] Preparation of component B: 30 parts of vinyl silicone oil, 1.5 parts of platinum catalyst, 0.6 parts of inhibitor and 0.5 parts of polyether polymer surfactant;

[0032] At 20-30°C, mix 15 parts of vinyl MQ silicone resin and 6 parts of fumed silica into components A and B, then mix evenly according to the mass ratio of 1:1, vacuumize and defoam for 5 minutes, and operate After completion, cure at 20-30°C for 3 hours. After the silicone is completely cured, pour epoxy resin into the silicone female mold. After the epoxy resin is completely cured, remove the mold and measure the depth of the pattern on the surface of the epoxy resin.

Embodiment 3

[0034] Preparation of component A: 35 parts of vinyl silicone oil, 30 parts of hydrogen silicone oil and 2 parts of polyether polymer surfactant;

[0035] Preparation of component B: 35 parts of vinyl silicone oil, 1.5 parts of platinum catalyst, 0.6 parts of inhibitor and 1 part of polyether polymer surfactant;

[0036] At 20-30°C, mix 20 parts of vinyl MQ silicone resin and 7 parts of fumed silica into components A and B, then mix evenly according to the mass ratio of 1:1, then vacuumize and defoam for 5 minutes. After the operation is completed, cure at 20-30°C for 3 hours. After the silicone is completely cured, pour epoxy resin into the silicone female mold. After the epoxy resin is completely cured, remove the mold and measure the depth of the pattern on the surface of the epoxy resin.

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Abstract

The invention relates to an addition type silica gel for remaking a refined decorative pattern mold, a preparation method and application thereof and solves the problem that the simulation rate of a decorative pattern of an epoxy mold is low as epoxy resin and a double-component addition type silica gel are poor in wettability. The addition type silica gel is prepared from the following componentsin parts by weight: 50-70 parts of vinyl silicone oil, 25-35 parts of hydrogen containing silicone oil, 20-40 parts of vinyl MQ silicone resin, 10-12 parts of fumed silica, 1-2 parts of a platinum catalyst, 0.1-1.0 part of an inhibitor and 0.1-3 parts of a high molecular surfactant of polyether. The preparation method comprises the following steps: uniformly mixing the vinyl silicone oil, the hydrogen containing silicone oil, the high molecular surfactant of polyether and the inhibitor as a component A; uniformly mixing the vinyl silicone oil, the platinum catalyst, the high molecular surfactant of polyether and the inhibitor as a component B; and then separately blending the vinyl MQ silicone resin and the fumed silica into the components A and B to be stirred and vacuumizing and defoaming the mixture to obtain the addition type silica gel. The addition type silica gel is good in wettability to an epoxy resin mold and can copy the decorative pattern of the mold precisely, and the addition type silica gel is simple in method and low in cost.

Description

technical field [0001] The invention belongs to the technical field of addition-type silica gel preparation, and in particular relates to an addition-type silica gel for remaking fine pattern molds, a preparation method and an application thereof. Background technique [0002] Automobile dashboard slush molds are generally used to produce soft skin products for automobile dashboards. During the preparation of the slush mold, epoxy resin needs to be poured into the textured silicone negative mold, the purpose of which is to accurately copy and transfer the surface texture of the silicone negative mold. During the production of epoxy molds, due to the poor wettability between polar epoxy resin and non-polar two-component addition type silica gel used to make the silicone negative mold, the polar epoxy resin cannot completely flow into the silicone negative film. In micron-scale grooves, the emulation rate of epoxy mold patterns is low. [0003] From the perspective of the ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08L71/00C08K3/36B29C33/40
Inventor 姚卫国王晓伟许东华石彤非窦艳丽管东波付志磊潘鸽马蕊李双双
Owner JILIN UNIV
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