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Composite resin composition, and electronic component molded from the composite resin composition

A composite resin and electronic component technology, applied in circuits, coupling devices, connections, etc., can solve the problems of asymmetry, complex shapes, and difficulty in suppressing warpage deformation, achieving excellent heat resistance, suppressing foaming, The effect of suppressing warping deformation

Active Publication Date: 2020-08-25
POLYPLASTICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, the connector for memory modules for notebook computers has a locking structure for installation and notches for alignment, so it has a very complicated shape
[0007] In the case of such an asymmetrical electronic component, it does not have symmetric Therefore, there is a limit to the improvement of warpage deformation from the aspect of forming method
In addition, in the case of an asymmetrical electronic component with a complex shape, the orientation of the resin and filler in the molded product becomes complicated, and higher fluidity is required, making it more difficult to suppress warpage

Method used

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  • Composite resin composition, and electronic component molded from the composite resin composition
  • Composite resin composition, and electronic component molded from the composite resin composition
  • Composite resin composition, and electronic component molded from the composite resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0153]

[0154] In the following examples and comparative examples, the liquid crystalline polymer 1 is the liquid crystalline polymer obtained in Synthesis Example 1. In addition, liquid crystalline polymers 2 and 3 were produced as follows.

[0155] In addition, in this Example, the measurement of the melting point and melt viscosity of a pellet was performed under the following conditions, respectively.

[0156] [Measurement of melting point]

[0157] After observation of the endothermic peak temperature (Tm1) observed when measuring liquid crystalline polymers with a DSC manufactured by TA Instruments Inc. at a temperature increase of 20°C / min from room temperature, the temperature at (Tm1+40)°C The temperature was kept at 20°C / min for 2 minutes, then once cooled to room temperature with a temperature decrease of 20°C / min, and then the temperature of the endothermic peak observed when the temperature was increased again at 20°C / min was measured.

[0158] [Measurement o...

Embodiment 1～4、 comparative example 1～3

[0191] The temperature of the barrel arranged at the main feed inlet was set to 250°C, and the temperatures of the other barrels were all set to 360°C. All the liquid crystalline polymers were supplied from the main feed port. In addition, the filler is fed from the side feed port.

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Abstract

Provided are: a composite resin composition from which electronic components can be obtained, the composite resin composition having excellent heat resistance and in which warping deformation and blistering are suppressed; and an electronic component formed from the composite resin composition. A composite resin composition according to the present invention includes (A) a liquid crystal polymer, (B) a fibrous filling agent, and (C) a plate-shaped filling agent. The (A) liquid crystal polymer comprises, as necessary constituent components, structure units (I) to (V) in prescribed amounts, and is a fully aromatic polyester amide that exhibits optical anisotropy during melting, and the weight-average fiber length of the (B) fibrous filling agent is 250 μm or more.

Description

technical field [0001] The present invention relates to a composite resin composition and an electronic component molded from the composite resin composition. Background technique [0002] Liquid crystal polymers are thermoplastic resins excellent in dimensional accuracy, fluidity, and the like. Due to these characteristics, liquid crystalline polymers have been used as materials for various electronic components. [0003] In particular, with the high performance of electronic equipment in recent years, there are also demands of the times such as high heat resistance of connectors (improved productivity due to mounting technology), high density (multi-core), and miniaturization. A liquid crystalline polymer composition reinforced with glass fibers has begun to be used as a connector material by utilizing the characteristics of the above-mentioned liquid crystalline polymer. [0004] However, in recent years, connectors have been made lighter, thinner and shorter. Due to in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/12C08G69/44C08K7/00H01R12/72H01R13/46
CPCC08G69/44C08K7/00C08L77/12H01R12/72H01R13/46
Inventor 深津博树泷智弘
Owner POLYPLASTICS CO LTD