Packaging method of polarization light emitting diode based on chip scale packaging

Abstract

The invention discloses a chip-level packaging-based packaging method of a polarized light-emitting diode. The method comprises the following steps: S1, LED chip inspection and microscopic examination: whether the surface of a material is mechanically damaged and has pits and pockmarks, whether the chip size and the electrode size meet process requirements, whether an electrode pattern is completeand the like are detected; S2, chip expanding: the films bonded with the chips are expanded by using a chip expander, wherein the distance between the LED chips is stretched to about 0.6 mm, manual expansion can also be adopted, but adverse problems that chips fall off and are wasted and the like are easily caused; and S3, dispensing: silver glue or insulating glue is dispensed at the corresponding positions of the LED support, the technological difficulty is that the dispensing amount is controlled, and due to the fact that the silver glue and the insulating glue have strict requirements forstorage and use. Compared with other packaging technologies, the method is low in technical price, space-saving, mature in process and capable of resisting stress, so that the protection degree of semiconductor packaging is improved, and the use quality of a semiconductor is greatly improved.

Description

technical field [0001] The invention relates to a circuit packaging process, and more specifically, to a packaging method of a polarized light-emitting diode based on chip-level packaging. Background technique [0002] LED (light-emitting diode) packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. The packaging of the LED is not only required to be able to protect the wick, but also to be able to transmit light. Therefore, LED packaging has special requirements for packaging materials. Packaging is a key link in the preparation of white LEDs: the light-emitting mechanism of semiconductor materials determines that a single LED chip cannot emit white light with a continuous spectrum, so two or more complementary colors must be mixed in the process. At present, there are three main methods to realize white LED: blue LED + YAG yellow phosphor, RGB three-color LED, ultraviolet LED + multi-color phosphor, and the r...

AI Technical Summary

Problems solved by technology

[0003] However, LEDs have strict requirements on the working environment. If the LED is not packaged, it will inevitably cause damage to the LED and cause the LED to fail to work normally. However, the traditional LED packaging level cannot meet the chip-level packaging standard, and the protection of the LED is not enough. Very in place, for this reason, we propose a packaging method for polarized light-emitting diodes based on chip-scale packaging