Loop heat pipe heat radiator with vapor-liquid two-phase flow jetting and pressure boosting device

Abstract

The invention relates to a loop heat pipe heat radiator with a vapor-liquid two-phase flow jetting and pressure boosting device. The loop heat pipe heat radiator with the vapor-liquid two-phase flow jetting and pressure boosting device comprises an evaporator, the vapor-liquid two-phase flow jetting and pressure boosting device, a boiling pool and a condenser, wherein the vapor-liquid two-phase flow jetting and pressure boosting device adopts a structure of feeding vapor from the center and feeding water from the circumference; an outlet of the evaporator is connected with the vapor-liquid two-phase flow jetting and pressure boosting device; the vapor-liquid two-phase flow jetting and pressure boosting device is connected with an inlet of the boiling pool; an outlet of the boiling pool isconnected with a condensate inlet of the tube-in-tube condenser; and an outlet of the condenser is connected with the evaporator. According to the loop heat pipe heat radiator with the vapor-liquid two-phase flow jetting and pressure boosting device provided by the invention, through additionally arranging the vapor-liquid two-phase flow jetting and pressure boosting device, part of subcooled liquid working medium can be directly introduced into the boiling pool without the need for passing through the evaporator, so that the problem of insufficiency in liquid supply of the boiling pool is solved; and meanwhile, through increasing the running power of the system, high-efficiency cooling and heat radiating of an electronic component and long-distance transmitting of heat are realized.

Description

technical field [0001] The invention belongs to the field of cooling and heat dissipation of electronic components, and relates to a heat pipe heat dissipation device, in particular to a loop heat pipe heat sink with a vapor-liquid two-phase flow jet boosting device. Background technique [0002] With the increasing integration, high power and miniaturization of electronic components, their heat generation has also increased sharply. How to dissipate this part of heat in a timely and effective manner has become an important factor restricting the development of electronic devices. Traditional air cooling and other methods can no longer meet the needs of its high heat dissipation rate. [0003] The loop heat pipe is a high-efficiency two-phase heat transfer device. It uses the capillary force generated by the capillary core in the evaporator to drive the circuit. It has significant advantages such as large heat transfer coefficient, no moving parts, and flexible layout. Amon...

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the problems of insufficient liquid supply and insufficient operating driving force in the boiling pool of the existing loop heat pipe, and propose a loop heat pipe radiator with a vapor-liquid two-phase flow injection booster device. The low-temperature liquid working medium is directly introduced into the boiling pool without passing through the evaporator, which increases the liquid supply of the boiling pool, and at the same time increases the pressure of the working medium, so that it can effectively dissipate heat from electronic devices under high heat flux

Images