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Manufacturing method for improving plating skip and platinum throwing problems after platinum electrodeposition

A production method and platinum technology, applied in printed circuit manufacturing, electrical components, printed circuits, etc., can solve problems such as electroplatinum missing plating, achieve the effects of solving missing plating, optimizing the production process, and preventing the platinum layer from falling off

Inactive Publication Date: 2019-06-07
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the existing technical defects and provide a method for improving the problems of electroplating missing plating and platinum rejection. rate, and reduces production costs

Method used

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Examples

Experimental program
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Embodiment

[0023] The present embodiment provides a kind of manufacturing method of PCB, including the manufacturing method that improves electroplatinum missing plating and rejecting platinum problem, and specific process is as follows:

[0024] (1) Cutting: cut out the core board according to the board size 520mm×620mm, the thickness of the core board is 0.8mm, and the thickness of the outer layer of copper foil is 1OZ.

[0025] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat a photosensitive film on the core board, the film thickness of the photosensitive film is controlled at 8 μm, and a fully automatic exposure machine is used to 5-6 grids The exposure ruler (21-grid exposure ruler) completes the exposure of the inner layer circuit on the core board, and after development, the inner layer circuit pattern is formed on the core board; the inner layer is etched, and the inner layer circuit is etched out of...

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PUM

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Abstract

The present invention discloses a manufacturing method for improving plating skip and platinum throwing problems after platinum electrodeposition. Film pasting is performed on a production panel, andwindowing is performed at a corresponding position to be subjected to platinum electrodeposition on the film; prior to platinum electrodeposition on the production panel, the pre-treatment of electrodeposition is performed on the production panel, wherein the pre-treatment of electrodeposition comprises panel edge encapsulation, acidic deoiling, washing with water, acid pickling and DI washing with water in order. The sulfuric acid is employed in the acid pickling to wash the production panel, the hydrochloric acid is employed to wash the production panel once again; and the platinum electrodeposition is performed on the production panel where windowing is performed, and the production panel is baked. The manufacturing method for improving plating skip and platinum throwing after platinumelectrodeposition can solve the plating skip and platinum throwing problems after platinum electrodeposition so as to improve the yield of the platinum electrodeposition and reduce the production cost.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a production method for improving the problems of electric platinum missing plating and platinum rejection. Background technique [0002] In addition to gold, silver, and tin, metal platinum also has excellent electrical conductivity, oxidation resistance, and good hardness, and is a good choice for surface treatment of circuit boards. In addition, platinum has good catalytic performance and can meet some special functional requirements, and electroplating platinum has been gradually applied to the surface treatment process of circuit boards. [0003] The process of electroplating platinum on the circuit board is generally "cutting → inner layer graphics → pressing → outer layer drilling → outer layer sinking copper → full board electroplating → outer layer graphics → graphic electroplating → nickel gold electroplating → electroplatinum graphics → Partia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18H05K3/22
Inventor 李红娇宋建远田小刚何为孙保玉
Owner SHENZHEN SUNTAK MULTILAYER PCB
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