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One-pack curable type thermally conductive silicone grease composition and electronic/electrical component

A technology of thermal conductive silicone grease and composition, applied in electrical components, lubricating compositions, electrical solid devices, etc., can solve problems such as physical properties, and achieve the effect of stable heat dissipation performance and high heat dissipation function

Active Publication Date: 2019-06-14
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the purpose of the present invention is to solve the problem of physical properties generated by using particulate catalysts in silicone grease compositions

Method used

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  • One-pack curable type thermally conductive silicone grease composition and electronic/electrical component
  • One-pack curable type thermally conductive silicone grease composition and electronic/electrical component
  • One-pack curable type thermally conductive silicone grease composition and electronic/electrical component

Examples

Experimental program
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Embodiment 1 to 6

[0196] [Examples 1 to 6], [Reference Examples 4, 5]

[0197]Using the method described above, components (A) to (E) and other components were mixed together in the blending amounts shown in Table 1 below to prepare a single-fluid curable thermally conductive silicone grease composition. Note that Si-H / Si-Vi (count ratio) in Table 1 is the ratio of the total number of SiH groups in the (B) component to the total number of alkenyl groups in the (A) component. After mixing (A), (C), (F), (G), (I) in a Ross mixer, heat and stir at 150° C. under vacuum for 1 hour. The mixture was then cooled to 25°C and returned to atmospheric pressure. Then, (B) and (E) were added, and after fixing, the (D) component was finally added, and the materials were mixed until uniform to prepare a single-fluid curable thermally conductive silicone grease composition. The characteristics of the single-fluid curable thermal grease composition and its cured material were measured, and the results are list...

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Abstract

The invention provides a one-pack curable type thermally conductive silicone grease composition which is excellent in terms of long-term storability and handleability and can be vertically held in a severe temperature environment; a method for applying the silicone grease composition; and an electronic device including the composition. A one-pack curable type thermally conductive silicone grease composition which comprises (A) an organopolysiloxane having at least one aliphatic unsaturated hydrocarbon group in the molecule and having a viscosity at 25 DEG C of 50-100,000 mPa.s, (B) an organohydrogensiloxane having at least two silicon-atom-bonded hydrogen atoms in the molecule, (C) a thermally conductive filler having particle diameters having an average particle diameter of 0.01-200 [mu]m, (D) a finely particulate catalyst which comprises a thermoplastic resin containing a platinum-based catalyst in an amount of 0.01 mass% or larger in terms of the amount of platinum-metal atoms and having a softening point of 40-200 DEG C and which has an average particle diameter of 0.01-10 [Mu]m, and (E) a curing control agent, and which after curing, has a complex elastic modulus at 25 DEG C of 0.01-20 MPa.

Description

technical field [0001] The invention relates to a single-fluid curable thermally conductive silicone grease composition, a method for coating the composition and an electronic device using the composition. Background technique [0002] Electronic components such as transistors, ICs, memory elements, etc. are mounted on printed circuit boards and hybrid ICs that are packaged for protection against the external environment, metal connections, and heat dissipation. As the density of installed semiconductors increases and the level of integration increases, thermally conductive silicone rubber compositions, thermally conductive silicone gel compositions, thermally conductive silicone grease compositions, single-fluid curable thermally conductive silicone grease compositions, etc. have been used developed and have been used to efficiently dissipate heat (Patent Documents 1-12). This makes it possible to cope with stringent cooling requirements. [0003] Heat sinks and the like ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K3/013C08K3/22C08K7/18C08L83/05H01L23/36H01L23/373
CPCC08K3/00H01L23/36H01L23/373C08G77/12C08G77/20C08G77/18C08L83/04C08K5/56C09D183/04C08K9/10C08K3/22C08L83/00C10M107/50C08G77/08C08K3/36C08K2201/001C08K3/013C08K2201/003
Inventor 加藤智子藤泽豊彦小玉春美大西正之
Owner DOW TORAY CO LTD
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