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53 results about "Aliphatic unsaturated hydrocarbon" patented technology

Cable semiconductive shield compositions

A composition comprising: (a) one or more copolymers selected from the group consisting of (I) a copolymer of ethylene and vinyl acetate containing about 10 to about 50 percent by weight vinyl acetate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes; (II) a copolymer of ethylene and ethyl acrylate containing about 10 to about 50 percent by weight ethyl acrylate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes; and (III) a copolymer of ethylene and butyl acrylate containing about 10 to about 50 percent by weight butyl acrylate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes, and based upon 100 parts by weight of component (a): (b) about 55 to about 200 parts by weight of a linear copolymer of ethylene and an alpha-olefin having 3 to 12 carbon atoms, the copolymer having a melt mass flow rate of about 0.1 to about 30 grams per 10 minutes and a density of 0.870 to 0.944 gram per cubic centimeter; (c) about 5 to about 50 parts by weight of polypropylene having a melt mass flow rate of about 0.5 to about 30 grams per 10 minutes and a density of 0.900 to 0.920 gram per cubic centimeter; (d) about 2 to about 50 parts by weight of an organopolysiloxane having the following formula: R1xR2ySiO(4-a-b)/2 wherein R1 is an aliphatic unsaturated hydrocarbon group; R2 is an unsubstituted or substituted monovalent hydrocarbon group excluding aliphatic unsaturated hydrocarbon groups; x is equal to or greater than 0 but less than 1; y is greater than 0.5 but less than 3; x+y is greater than 1 but less than 3; a is greater than 0 but equal to or less than 1; and b is equal to or greater than 0.5 but equal to or less than 3; (e) about 10 to about 350 parts by weight of carbon black; and (f) optionally, up to about 2 parts by weight of an organic peroxide.
Owner:NIPPON YUNIKAA

Liquid potting composite of dicomponent addition type silicone rubber and preparation

The invention relates to a liquid filling and sealing composition for bi-component additive silicon rubber and a preparation method thereof. The composition comprises the following components from (A) to (F): (A) 100 mass portions of univalent unsaturated fatty hydrocarbon polysiloxane, wherein at least 2 or more than 2 bonds in each molecule are connected to a silicon atom; (B) 0.1 to 50 mass portions of hydrogen atomic hydrogenated polysiloxane, wherein at least 2 or more than 2 bonds in each molecule are connected to a silicon atom; (C) 10 to 70 mass portions of electronic grade quartz powder; (D) platinum based catalyst; (E) a triazole compound; and (F) 0.001 to 0.009 mass portion of acetylenyl cyclohexanol. The preparation method is as follows: the (A) component, the (B) component and the (C) component are mixed and milled by a kneader to prepare a basic composition; and the (D) component, the (E) component and the (F) component are added into the basic composition, and the mixture is subjected to vacuum defoamation and high-temperature solidification to obtain the silicon rubber. The liquid filling and sealing composition for the bi-component additive silicon rubber is convenient to use, is safe and reliable, does not pollute the environment, has stable service performance, can not be cracked at a low temperature, and has the characteristics of moisture protection, dust prevention, corrosion resistance, shock resistance and so on.
Owner:ZHEJIANG XINAN CHEM INDAL GROUP

Cable semiconductive shield compositions

A composition comprising: (a) one or more copolymers selected from the group consisting of (I) a copolymer of ethylene and vinyl acetate containing about 10 to about 50 percent by weight vinyl acetate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes; (II) a copolymer of ethylene and ethyl acrylate containing about 10 to about 50 percent by weight ethyl acrylate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes; and (III) a copolymer of ethylene and butyl acrylate containing about 10 to about 50 percent by weight butyl acrylate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes, and based upon 100 parts by weight of component (a): (b) about 55 to about 200 parts by weight of a linear copolymer of ethylene and an alpha-olefin having 3 to 12 carbon atoms, the copolymer having a melt mass flow rate of about 0.1 to about 30 grams per 10 minutes and a density of 0.870 to 0.944 gram per cubic centimeter; (c) about 1 to about 50 parts by weight of an organopolysiloxane having the following formula: R1xR2ySiO(4-a-b) / 2 wherein R1 is an aliphatic unsaturated hydrocarbon group; R2 is an unsubstituted or substituted monovalent hydrocarbon group excluding aliphatic unsaturated hydrocarbon groups; x is equal to or greater than 0 but less than 1; y is greater than 0.5 but less than 3; x+y is greater than 1 but less than 3; a is greater than 0 but equal to or less than 1; and b is equal to or greater than 0.5 but equal to or less than 3; (d) about 10 to about 350 parts by weight of carbon black; and (e) optionally, up to about 2 parts by weight of an organic peroxide.
Owner:NIPPON YUNIKAA

Cable semiconductive shield compositions

A composition comprising:(a) one or more copolymers selected from the group consisting of (I) a copolymer of ethylene and vinyl acetate containing about 10 to about 50 percent by weight vinyl acetate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes; (II) a copolymer of ethylene and ethyl acrylate containing about 10 to about 50 percent by weight ethyl acrylate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes; and (III) a copolymer of ethylene and butyl acrylate containing about 10 to about 50 percent by weight butyl acrylate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes, and based upon 100 parts by weight of component (a):(b) about 55 to about 200 parts by weight of a linear copolymer of ethylene and an alpha-olefin having 3 to 12 carbon atoms, the copolymer having a melt mass flow rate of about 0.1 to about 30 grams per 10 minutes and a density of 0.870 to 0.944 gram per cubic centimeter;(c) about 5 to about 50 parts by weight of polypropylene having a melt mass flow rate of about 0.5 to about 30 grams per 10 minutes and a density of 0.900 to 0.920 gram per cubic centimeter;(d) about 2 to about 50 parts by weight of an organopolysiloxane having the following formula: R<1>xR<2>ySiO(4-a-b) / 2wherein R<1 >is an aliphatic unsaturated hydrocarbon group; R<2 >is an unsubstituted or substituted monovalent hydrocarbon group excluding aliphatic unsaturated hydrocarbon groups; x is equal to or greater than 0 but less than 1; y is greater than 0.5 but less than 3; x+y is greater than 1 but less than 3; a is greater than 0 but equal to or less than 1; and b is equal to or greater than 0.5 but equal to or less than 3;(e) about 10 to about 350 parts by weight of carbon black; and(f) optionally, up to about 2 parts by weight of an organic peroxide.
Owner:NIPPON YUNIKAA

One-pack curable type thermally conductive silicone grease composition and electronic/electrical component

ActiveCN109890900AControl physical propertiesStable cooling functionSemiconductor/solid-state device detailsSolid-state devicesPlatinumPolymer science
The invention provides a one-pack curable type thermally conductive silicone grease composition which is excellent in terms of long-term storability and handleability and can be vertically held in a severe temperature environment; a method for applying the silicone grease composition; and an electronic device including the composition. A one-pack curable type thermally conductive silicone grease composition which comprises (A) an organopolysiloxane having at least one aliphatic unsaturated hydrocarbon group in the molecule and having a viscosity at 25 DEG C of 50-100,000 mPa.s, (B) an organohydrogensiloxane having at least two silicon-atom-bonded hydrogen atoms in the molecule, (C) a thermally conductive filler having particle diameters having an average particle diameter of 0.01-200 [mu]m, (D) a finely particulate catalyst which comprises a thermoplastic resin containing a platinum-based catalyst in an amount of 0.01 mass% or larger in terms of the amount of platinum-metal atoms and having a softening point of 40-200 DEG C and which has an average particle diameter of 0.01-10 [Mu]m, and (E) a curing control agent, and which after curing, has a complex elastic modulus at 25 DEG C of 0.01-20 MPa.
Owner:DOW TORAY CO LTD
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