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Conductive liquid silicon rubber-based adhesive and preparation method for composition thereof

A silicone rubber composition, liquid silicone rubber technology, applied to conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of increased processing procedures, limited application fields, low modulus strength, etc., and achieves less material loss, The effect of outstanding electrical conductivity and short production process cycle

Active Publication Date: 2011-04-13
GUANGZHOU TINCI MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN03809897.0 discloses a conductive silicone rubber composition, which is based on alkenyl organopolysiloxane, hydrogen-containing organopolysiloxane is used as a crosslinking agent, and metal powder is used as a conductive filler. Excellent conductivity, volume resistivity can reach 10 -2 Ω·cm, but the cost of the material is high, and the performance of the material is restricted by the fineness of the metal powder and its compatibility with silicone rubber
Patent CN200810060489.6 uses acetylene carbon black as the conductive medium, firstly uses the treatment agent to pretreat the acetylene carbon black, and then cooperates with reinforcing silicone rubber to make conductive silicone rubber material, which can improve the floating of carbon black and is beneficial to the health of operators Healthy, but the processing steps are increased, and there is also pollution in the carbon black treatment stage
Patent CN201010011842.9 discloses a low-modulus, high-strength room temperature vulcanized conductive silicone rubber, which has excellent physical properties, moderate hardness, and good mechanical properties, and can be used to produce various electrical connectors, electrical seals and shock absorbers. Rubber products, but this conductive silicone rubber adopts a condensation curing system, which will release toxic or corrosive gases during the curing process, and the material shrinks greatly during the curing process, so the application field is greatly limited

Method used

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  • Conductive liquid silicon rubber-based adhesive and preparation method for composition thereof
  • Conductive liquid silicon rubber-based adhesive and preparation method for composition thereof
  • Conductive liquid silicon rubber-based adhesive and preparation method for composition thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Add 100 parts by mass of α,ω-divinyl polydimethylsiloxane (viscosity at 25°C: 3000 mPa·s) and 60 parts by mass of fumed silica (specific surface area: 150 m 2 / g), 20 parts by mass of silver powder (average particle size 20 microns), 25 parts by mass of hexamethyldisilazane, the material was stirred at room temperature for 2.0 hours, heated to a material temperature of 140°C, heated and kneaded for 2.0 hours, vacuum After de-lowering for 4 hours, 80 parts by mass of the above-mentioned α,ω-divinyl polydimethylsiloxane and 20 parts by mass of silicone resin (e) were added, mixed evenly, ground by a three-roll machine, and filtered. Finally, the liquid silicone rubber base compound is obtained.

[0046] Add 0.05 parts by mass of 1% isopropanol solution of chloroplatinic acid to 100 parts by mass of the liquid silicone rubber base compound, stir evenly, remove air bubbles, and filter to obtain component (A).

[0047] In 100 parts by mass of liquid silicone rubber base com...

Embodiment 2

[0056] Add 100 parts by mass of α,ω-allyldimethyl polydimethylsiloxane (viscosity at 25°C: 10,000 mPa·s) and 50 parts by mass of fumed silica (specific surface area 200m 2 / g), 50 parts by mass of acetylene carbon black (average particle size 0.01 micron), 20 parts by mass of hexamethyldisilazane, the material was stirred at room temperature for 3.0 hours, heated to a material temperature of 160°C, heated and mixed for 6.0 hours, After vacuuming for 2.0 hours, 40 parts by mass of α,ω-allyldimethyl polydimethylsiloxane and 30 parts by mass of silicone resin (e) were added, mixed evenly, ground and filtered by a three-roll machine. Finally, the liquid silicone rubber base compound is obtained.

[0057] Add 0.2 parts by mass of 1% isopropanol solution of chloroplatinic acid to 100 parts by mass of the liquid silicone rubber base compound, stir evenly, remove air bubbles, and filter to obtain component (A).

[0058] Add 4.0 parts by mass of polymethylhydrogensiloxane (h) and 0.2...

Embodiment 3

[0067] Add 100 parts by mass of α,ω-butenyl dimethyl polydimethylsiloxane (viscosity at 25°C: 15000 mPa·s) and 30 parts by mass of precipitated silica (specific surface area 150m 2 / g), 40 parts by mass of acetylene carbon black (average particle size 0.1 micron), 15 parts by mass of dimethyldimethoxysilane, the material was stirred at room temperature for 5.0 hours, heated to a material temperature of 180 ° C, heated and mixed for 4.0 hours , and then add 100 parts by mass of α,ω-butenyl dimethylpolydimethylsiloxane and 60 parts by mass of silicone resin (e), mix well, grind and filter through a three-roll machine. Finally, the liquid silicone rubber base compound is obtained.

[0068] Add 0.5 parts by mass of 1% platinum diacetoacetate solution to 100 parts by mass of the liquid silicone rubber base compound, stir evenly, remove air bubbles, and filter to obtain component (A).

[0069] Add 6.0 parts by mass of polymethylhydrogensiloxane (h) and 0.5 parts by mass of 1-ethyn...

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Abstract

The invention discloses a conductive liquid silicon rubber-based adhesive (A), which comprises 100 to 200 mass parts of aliphatic unsaturated hydrocarbon-terminated organic polybisiloxane (a), 10 to 60 mass parts of silica reinforcing filler (b), 10 to 60 mass parts of conductive filler (c) and 5 to 25 mass parts of structural controller (d). In addition, the invention also discloses a conductiveliquid silicon rubber composition, which consists of the component (A) and a component (B) according to a mass ratio of 1:1. The component (A) comprises 100 mass parts of the conductive liquid silicon rubber-based adhesive and 0.05 to 0.5 mass part of addition reaction catalyst; and the component (B) comprises 100 mass parts of the conductive liquid silicon rubber-based adhesive, 2 to 10 mass parts of crosslinking agent (h), 0.04 to 0.5 mass part of addition reaction inhibitor (i) and 0.03 to 2.0 mass parts of pigment (j). The invention also discloses preparation methods and use of the adhesive and the composition.

Description

technical field [0001] The invention belongs to the technical field of conductive liquid silicone rubber materials, and in particular relates to a preparation method of an addition-type conductive liquid silicone rubber capable of rapid curing at high temperature, high mechanical strength, low volume resistivity, and low permanent compression deformation. Background technique [0002] In recent years, with the rapid development of science and technology, various high-frequency electronics, electrical equipment, high-voltage power equipment, etc. radiate a large number of electromagnetic waves of different wavelengths and frequencies into the space during work, resulting in new environmental pollution and electromagnetic waves. interference. In order to solve the interference and leakage caused by electromagnetic wave radiation, conductive materials are often used for shielding, such as metal or conductive plastic shells. However, the joints, bonding points, small holes and ...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08K3/36C08L83/05H01B1/20
Inventor 杨思广
Owner GUANGZHOU TINCI MATERIALS TECH
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