One-pack addition curable silicone composition, method for storing same, and method for curing same

a silicone composition and additive technology, applied in the direction of liquid surface applicators, coatings, pretreated surfaces, etc., can solve the problems of degrading performance, inefficient heat transfer, and failing to fully reduce the temperature of the heat generating member

Inactive Publication Date: 2017-09-14
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0035]The one-pack addition curable silicone composition of the invention meets both long-term storage stability at room temperature under limited air-shutoff conditions and the progress of addition cure reaction at room temperature when it is applied as a thin film of up to 1,500 μm and exposed to air, which are difficult to achieve with the prior art.
[0036]Below the invention is described in detail.
[0037]The invention provides a one-pack addition curable silicone composition comprising the following components (A) to (

Problems solved by technology

It is well known that electronic parts such as semiconductor packages generate heat during operation and concomitantly degrade their performance.
If a gap is left between the heat generating member and the cooling member, the heat transfer becomes inefficient due to the intervention of least heat conductive air, failing to fully reduce the temperature of the heat generating member.
On the other hand, the heat dissipating grease of cure type, which is compressed to a desired thickness and then cured, is less prone to pump-out and makes the semiconductor package more reliable, but has practical disadvantages.
However, most of these greases lack storage stability at room temperature and must be stored in freezers or refrigerators, suggesting difficult

Method used

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  • One-pack addition curable silicone composition, method for storing same, and method for curing same
  • One-pack addition curable silicone composition, method for storing same, and method for curing same
  • One-pack addition curable silicone composition, method for storing same, and method for curing same

Examples

Experimental program
Comparison scheme
Effect test

synthesis example 1

[0100]A 100-ml flask recovery flask was charged with 0.31 g (0.93 mmol) of trihexyl phosphite, 3.0 g (0.15 mmol of platinum atom) of a solution of platinum-divinyltetramethyldisiloxane complex in the same dimethylpolysiloxane as A-1 (platinum atom content: 1 wt % of platinum atom), and 6.7 g of toluene. The contents were stirred at RT for 3 hours, obtaining 9.8 g of colorless transparent platinum-trihexyl phosphite complex.[0101]D-2: platinum-triphenyl phosphite complex obtained in Synthesis Example 2 below

synthesis example 2

[0102]A 100-ml flask recovery flask was charged with 0.29 g (0.93 mmol) of triphenyl phosphite, 3.0 g (0.15 mmol of platinum atom) of a solution of platinum-divinyltetramethyldisiloxane complex in the same dimethylpolysiloxane as A-1 (platinum atom content: 1 wt % of platinum atom), and 6.7 g of toluene. The contents were stirred at RT for 3 hours, obtaining 9.8 g of colorless semi-transparent platinum-triphenyl phosphite complex.[0103]D-3: solution of platinum-divinyltetramethyldisiloxane complex in the same dimethylpolysiloxane as A-1 (platinum atom content: 1 wt % of platinum atom)

Component (E)

[0104]E-1: trimethoxysilyl-containing dimethylpolysiloxane of the following formula

Component (F)

[0105]F-1: decyltrimethoxysilane of the following formula

[Chemical Formula 11]

C10H21—Si(OCH3)3

Other Component

[0106]G-1: acetylene alcohol of the following formula

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Abstract

Provided are a one-pack addition curable silicone composition compatible with both a good long-term storage property at room temperature under conditions whereby air is blocked to a constant level and the advance of an addition curing reaction at room temperature by being applied in a thin film of 1500 μm or less and exposed to air, which could not be obtained by conventional curable heat-dissipating grease, and a method for storing the same, and a method for curing this composition. A one-pack addition curable silicone composition having as essential ingredients: (A) organopolysiloxane having silicon-atom-bonded aliphatic unsaturated hydrocarbon groups and a specific kinematic viscosity; (B) one or more thermally conductive fillers selected from metals, metal oxides, metal hydroxides, metal nitrides, metal carbides, and allotropes of carbon; (C) organohydrogenpolysiloxane; and (D) a platinum group metal complex having an organic phosphorus compound represented by formula (1)
R1x—P—(OR1)3-x   (1)
(R1 is a monovalent hydrocarbon group, x is 0-3) as a ligand.

Description

TECHNICAL FIELD[0001]This invention relates to a one-pack addition curable silicone composition. More particularly, it relates to a one-pack addition curable silicone composition for providing a highly heat conductive silicone grease, which meets both long-term storage stability at room temperature under limited air-shutoff conditions and the progress of addition cure reaction at room temperature when it is applied as a thin film of up to 1,500 μm and exposed to air, a method for storing the composition, and a method for curing the composition.BACKGROUND ART[0002]It is well known that electronic parts such as semiconductor packages generate heat during operation and concomitantly degrade their performance. A variety of heat dissipating techniques are used to solve the problem. One common technique is by disposing a cooling member such as heat spreader near a heat generating member, bringing them in close contact, and effectively removing heat from the cooling member.[0003]If a gap i...

Claims

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Application Information

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IPC IPC(8): C08L83/04B05D3/04
CPCC08L83/04C08L2205/025B05D3/0406C08K3/08C08K3/22C08K3/28C08K5/53C08K5/5419C08L83/06C08G77/12C08G77/20C08K5/5377C08L83/00C08K5/5393C08K5/56
Inventor KITAZAWA, KEITAMASUDA, KOHEI
Owner SHIN ETSU CHEM IND CO LTD
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