One-pack addition curable silicone composition, method for storing same, and method for curing same

Abstract

Provided are a one-pack addition curable silicone composition compatible with both a good long-term storage property at room temperature under conditions whereby air is blocked to a constant level and the advance of an addition curing reaction at room temperature by being applied in a thin film of 1500 μm or less and exposed to air, which could not be obtained by conventional curable heat-dissipating grease, and a method for storing the same, and a method for curing this composition. A one-pack addition curable silicone composition having as essential ingredients: (A) organopolysiloxane having silicon-atom-bonded aliphatic unsaturated hydrocarbon groups and a specific kinematic viscosity; (B) one or more thermally conductive fillers selected from metals, metal oxides, metal hydroxides, metal nitrides, metal carbides, and allotropes of carbon; (C) organohydrogenpolysiloxane; and (D) a platinum group metal complex having an organic phosphorus compound represented by formula (1)R1x—P—(OR1)3-x   (1)(R1 is a monovalent hydrocarbon group, x is 0-3) as a ligand.

Description

TECHNICAL FIELD[0001]This invention relates to a one-pack addition curable silicone composition. More particularly, it relates to a one-pack addition curable silicone composition for providing a highly heat conductive silicone grease, which meets both long-term storage stability at room temperature under limited air-shutoff conditions and the progress of addition cure reaction at room temperature when it is applied as a thin film of up to 1,500 μm and exposed to air, a method for storing the composition, and a method for curing the composition.BACKGROUND ART[0002]It is well known that electronic parts such as semiconductor packages generate heat during operation and concomitantly degrade their performance. A variety of heat dissipating techniques are used to solve the problem. One common technique is by disposing a cooling member such as heat spreader near a heat generating member, bringing them in close contact, and effectively removing heat from the cooling member.[0003]If a gap i...

AI Technical Summary

Benefits of technology

The invention is a one-pack addition curable silicone composition that has good storage stability and can cure when exposed to air. It contains specific components and a heat conductive filler to achieve its properties. The composition can be used as a thin film with a thickness of up to 1,500 μm. The technical effect of the invention is to provide a stable and efficient silicone composition for various applications such as adhesives, sealants, and coating materials.

Problems solved by technology

It is well known that electronic parts such as semiconductor packages generate heat during operation and concomitantly degrade their performance.

If a gap is left between the heat generating member and the cooling member, the heat transfer becomes inefficient due to the intervention of least heat conductive air, failing to fully reduce the temperature of the heat generating member.

On the other hand, the heat dissipating grease of cure type, which is compressed to a desired thickness and then cured, is less prone to pump-out and makes the semiconductor package more reliable, but has practical disadvantages.

However, most of these greases lack storage stability at room temperature and must be stored in freezers or refrigerators, suggesting difficult management of products.

To cure the grease, a certain time of heating is necessary, inviting a lowering of production efficiency due to complicated steps and extended duration.

Further the heating step poses an environmental load.

However, the grease gives off low-boiling ingredients during the curing reaction, leaving serious problems including a foul odor and contamination of electronic parts with the released ingredients.

Although the use of heat dissipating greases of cure type is preferred in order to enhance the reliability of semiconductor packages as discussed above, the heat dissipating greases proposed in the prior art are rarely regarded satisfactory from the standpoints of product management, curing process and curing reaction mechanism.

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