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Circuit board fabrication method

A circuit board manufacturing, circuit board technology, applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problem of high slurry volume

Inactive Publication Date: 2019-06-18
黄成有
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] (2) Add alkaline substances (such as: sodium hydroxide) to make heavy metals into hydroxides, and then remove them by precipitation. The volume of slurry (Sludge) generated in this way is relatively high, and it is not suitable for waste liquids containing high concentrations Copper ions are used

Method used

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  • Circuit board fabrication method
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Embodiment Construction

[0024] see figure 1 As shown, it can be clearly seen from the figure that when the present invention is implemented, an electrode 1 is first prepared, and this electrode 1 is composed of hexagonal closest-packed (HCP) metal crystals, such as titanium, zinc, magnesium, beryllium , in consideration of cost, safety and applicability, it is more appropriate to choose titanium metal, and a circuit pattern is formed on the surface of the electrode 1, and then the electrode 1 is placed in a solution containing copper ions, which can be used for electroplating, etching... The waste liquid generated in the process, etc., and the electrode 1 is placed in the solution and then connected to a negative charge, so that the negatively charged electrode 1 attracts copper ions in the solution, and the copper ions are deposited on the surface of the electrode 1 to form the same pattern as the circuit pattern. conductive layer 2, and then take the electrode 1 out of the solution, and transfer th...

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Abstract

A circuit board fabrication method comprises the steps of firstly, fabricating an electrode, wherein a circuit pattern is formed on an electrode surface; secondly, placing the electrode in a copper ion-containing solution, introducing negative power to the electrode, and allowing copper ions in the solution to be deposited on the electrode surface to form a conductive layer same as the circuit pattern; and thirdly, taking the electrode out of the solution, and transferring the conductive layer to an insulation substrate to form a circuit board. The process of the circuit board is further simplified, the concentration of the copper ions in waste liquid is substantially reduced, and the processing cost of the waste liquid is reduced.

Description

technical field [0001] A method for manufacturing a circuit board, especially a method for forming a conductive layer by depositing copper ions, and transferring the conductive layer to an insulating substrate to form a circuit board. Background technique [0002] During the production process of the circuit board, there will be multiple processes such as electroplating, exposure, etching, etc. In addition to causing a substantial increase in cost, a large amount of copper-containing waste liquid will be generated. In other words, the common way is as follows: [0003] (1) React the waste liquid with iron to precipitate and recycle metallic copper. This method not only has a low ratio of copper recovery, but also leaves iron ions dissolved due to the reaction with copper ions, as well as unrecovered Copper ion, therefore must carry out the processing of waste liquid additionally. [0004] (2) Add alkaline substances (such as: sodium hydroxide) to make heavy metals into hyd...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/20
Inventor 黄成有
Owner 黄成有